公开(公告)号：US20060032582A1

公开(公告)日：2006-02-16

申请号：US10917807

申请日：2004-08-13

申请人： Chien-Hua Chen ,  Paul Reboa ,  Tracey Forrest

发明人： Chien-Hua Chen ,  Paul Reboa ,  Tracey Forrest

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01067 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method for bonding a plurality of substrates includes performing a gas plasma treatment on the plurality of substrates, and performing a water plasma treatment on the plurality of substrates. Additionally, a system for performing low temperature plasma enhanced bonding includes a substrate housing structure having a substrate receiving volume, a gas source fluidly coupled to the substrate housing structure, a water vapor source fluidly coupled to the substrate housing structure, and a radio-frequency (RF) generator coupled to the substrate housing structure, wherein the system is configured to perform both a gas plasma treatment and a water plasma treatment on a substrate.

摘要翻译： 用于接合多个基板的方法包括对多个基板执行气体等离子体处理，并对多个基板进行水等离子体处理。 另外，用于执行低温等离子体增强接合的系统包括具有基板接收体积的基板壳体结构，与基板壳体结构流体耦合的气体源，流体耦合到基板壳体结构的水蒸气源，以及射频 （RF）发生器，其耦合到所述衬底壳体结构，其中所述系统被配置为在衬底上执行气体等离子体处理和水等离子体处理。