公开(公告)号：US20080006933A1

公开(公告)日：2008-01-10

申请号：US11704599

申请日：2007-02-08

申请人： Chien-Ping Huang ,  Ho-Yi Tsai ,  Wen Tsung Tseng

发明人： Chien-Ping Huang ,  Ho-Yi Tsai ,  Wen Tsung Tseng

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/4334 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The invention provides a heat-dissipating package structure and a fabrication method thereof. The fabrication method includes the steps of mounting and electrically connecting a semiconductor chip to a chip carrier; mounting on the semiconductor chip a heat-dissipating member having an interface layer; performing a molding process to form an encapsulant that encapsulates the semiconductor chip and the heat-dissipating member; cutting the chip carrier and the encapsulant according to a predetermined package size and forming an oblique angle on a top edge of the encapsulant to partially expose an edge of the heat-dissipating member; and removing the encapsulant located on the interface layer. During the molding process, the formed encapsulant can cover the interface layer due to a spacing height exists between the interface layer and the top wall of the mold cavity, thereby preventing damages to the semiconductor chip pressed by the mold and the problem of flash.

摘要翻译： 本发明提供一种散热封装结构及其制造方法。 该制造方法包括将半导体芯片安装并电连接到芯片载体的步骤; 在所述半导体芯片上安装具有界面层的散热构件; 进行成型工序以形成密封半导体芯片和散热构件的密封剂; 根据预定的包装尺寸切割所述芯片载体和所述密封剂，并在所述密封剂的顶部边缘上形成斜角以部分地暴露所述散热构件的边缘; 并移除位于界面层上的密封剂。 在成型过程中，由于在界面层和模腔顶壁之间存在间隔高度，所形成的密封剂可以覆盖界面层，从而防止对由模具挤压的半导体芯片的损坏和闪光的问题。