公开(公告)号：US20140063731A1

公开(公告)日：2014-03-06

申请号：US13599433

申请日：2012-08-30

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

摘要翻译： 可调式散热器组件包括具有从其底壁突出的平坦接触面的导热底板，安装在热导性底板中的高度调节紧固件并且紧固到电路板并垂直调节以保持平坦接触 面对与电路板上的热源正接触，热导顶板，连接热导性底板和热导顶板的节距调节紧固件，并可调节以控制热导电底板之间的距离 并且使导热顶板与使用电路板的电子设备的壳体，面板或辐射翅片保持正接触，以及连接在热导性底板和 热导顶板。

公开(公告)号：US20070049074A1

公开(公告)日：2007-03-01

申请号：US11162002

申请日：2005-08-25

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H01R13/648

CPC分类号： H05K7/1418 ,  H01R12/721 ,  H01R13/6582 ,  H05K7/1487 ,  H05K9/0016

摘要： An elastic earthing plate for a server case is provided. The elastic earthing plate comprises two buckling portions formed on two sides thereof for respectively buckling to corresponding sidewalls of tracks for positioning. Each buckling portion comprises an extended arm at a distal end thereof for clamping a base plate to avoid displacement or shock occurring during the sliding of the base plate in the track, and thereby secure the base plate in the case. Thus, it is not only possible to form a reliable earthing loop between the base plate and the arm but also to position the base plate between the two arms of the elastic earthing plate to substantially ensure the earthing effect. The assembly and disassembly of the elastic earthing plate may also be easily implemented.

摘要翻译： 提供了一种用于服务器机箱的弹性接地板。 弹性接地板包括形成在其两侧的两个弯曲部分，用于分别弯曲到用于定位的轨道的相应侧壁。 每个弯曲部分包括在其远端处的延伸臂，用于夹紧基板以避免在基板在轨道中滑动期间发生位移或冲击，从而将基板固定在壳体中。 因此，不仅可以在基板和臂之间形成可靠的接地环，还可以将基板定位在弹性接地板的两个臂之间，以基本上确保接地效果。 弹性接地板的组装和拆卸也可以容易地实现。

公开(公告)号：US08861203B2

公开(公告)日：2014-10-14

申请号：US13599433

申请日：2012-08-30

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

摘要翻译： 可调式散热器组件包括具有从其底壁突出的平坦接触面的导热底板，安装在热导性底板中的高度调节紧固件并且紧固到电路板并垂直调节以保持平坦接触 面对与电路板上的热源正接触，热导顶板，连接热导性底板和热导顶板的节距调节紧固件，并可调节以控制热导电底板之间的距离 并且使导热顶板与使用电路板的电子设备的壳体，面板或辐射翅片保持正接触，并且连接在热导性底板和 热导顶板。

公开(公告)号：US07558065B2

公开(公告)日：2009-07-07

申请号：US11826741

申请日：2007-07-18

申请人： Chih-Liang Fang ,  Yie-Tun Huang

发明人： Chih-Liang Fang ,  Yie-Tun Huang

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.

摘要翻译： 本发明公开了一种具有至少一个散热器和至少一个热管的空气引导件。 空气引导管的热管能够将由热源产生的热量传导到导流器的散热片。 导风板的散热器增加了散热面积，散热片的分布使得更多的吹入空气能够将热量带走。 因此，本发明的空气引导件可以提高电子设备内的散热效率。

公开(公告)号：US20090021918A1

公开(公告)日：2009-01-22

申请号：US12212654

申请日：2008-09-18

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/4006 ,  H01L23/433 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation. Each first heat transfer device comprises a first heat-transfer sheet member having a high heat conductivity and a low thermal resistance and bonded to one first heat generating electronic device, an elastically deformable second heat-transfer sheet member having a low heat conductivity and a high thermal resistance and bonded to the heat plate to compensate for height tolerance of the respective first heat generating electronic device, and a heat-transfer block for spreading heat energy from the first heat-transfer sheet member onto the heat plate through the second heat-transfer sheet member.

摘要翻译： 公开了一种用于散发来自电路板的热量的堆叠传热接口结构，包括固定到电路板的加热板，以及相对较薄的第一传热装置和相对较厚的第二传热装置，其分别附接到第一和第二发热电子 具有不同高度的电路板的装置，用于将热量从电路板的第一和第二发热电子装置传递到散热板。 每个第一传热装置包括具有高导热性和低热阻并且结合到一个第一发热电子装置的第一传热片部件，具有低导热性和高热导率的可弹性变形的第二传热片部件 热电阻并且结合到加热板以补偿各个第一发热电子设备的高度公差，以及传热块，用于通过第二传热将来自第一传热片部件的热能传递到加热板上 片材成员。

公开(公告)号：US20080057279A1

公开(公告)日：2008-03-06

申请号：US11469478

申请日：2006-08-31

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： B32B7/02

CPC分类号： B32B7/02 ,  H01L23/3672 ,  H01L23/433 ,  H01L2924/0002 ,  Y10T428/24942 ,  H01L2924/00

摘要： A laminated heat-transfer interface used in a cooler module to dissipate heat from heat generating devices of a circuit board is disclosed to include a heat plate affixed to the circuit board, first heat-transfer sheet members of high Kelvin value and low heat resistance material respectively attached to the heat generating devices of the circuit board, second heat-transfer sheet members of elastically deformable low Kelvin value and high heat resistance material having the characteristic of transferring heat energy in vertical direction respectively bonded to the heat plate, and flat heat-transfer blocks having the characteristic of transferring heat energy evenly in horizontal direction and vertical direction respectively sandwiched between the first heat-transfer sheet members and the second heat-transfer sheet members.

摘要翻译： 公开了一种在冷却器模块中用于从电路板的发热装置散发热量的层压传热接口，包括固定在电路板上的加热板，具有高开尔文值的第一传热片材和低耐热材料 分别安装在电路板的发热元件上，具有可弹性变形的低开尔文值的第二传热片构件和具有分别结合到加热板的垂直方向传递热能的特性的高耐热材料， 具有分别夹在第一传热片构件和第二传热片构件之间的沿水平方向和垂直方向均匀地传递热能的特性的传递块。

公开(公告)号：US07301778B1

公开(公告)日：2007-11-27

申请号：US11381536

申请日：2006-05-04

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H05K7/10

CPC分类号： H05K7/1409 ,  H05K7/1487

摘要： An ATCA locking lever mounting structure installed in a motherboard blade formed of a motherboard and a face panel and inserted into a machine case of a server system is disclosed to included a grounding plate fixedly provided at the motherboard near a through hole on the face panel, and a locking lever pivoted to a pivot device at the motherboard and turnable about the pivot device between the locking position where the locking lever locks the motherboard blade to the machine case of the server system and connects the grounding plate to the machine case to have the motherboard be grounded, and the unlocking position where the motherboard blade is unlocked from the machine case.

摘要翻译： 公开了一种安装在由主板和面板形成并且插入服务器系统的机壳中的主板叶片中的ATCA锁定杆安装结构，包括：靠近面板上的通孔附近的母板处的接地板， 以及锁定杆，其枢转到主板处的枢转装置，并且在锁定杆将主板叶片锁定到服务器系统的机壳的锁定位置之间围绕枢轴装置可转动，并将接地板连接到机器壳体，以使 主板接地，并且主板刀片从机箱中解锁的解锁位置。

公开(公告)号：US20070093092A1

公开(公告)日：2007-04-26

申请号：US11567722

申请日：2006-12-06

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H01R13/648

CPC分类号： H05K7/1418 ,  H01R12/721 ,  H01R13/655 ,  H01R13/6582 ,  H05K7/1487 ,  H05K9/0016

摘要： A grounding spring plate mounting structure includes a metal grounding spring plate mounted on each track inside a case for blade server to secure and ground a computer motherboard blade. The metal grounding spring plate has a flat base fitted into a recessed portion of the track, two channel-like mounting frames disposed at two sides of the flat base and respectively mounted on two parallel rails of the track and defining with the flat base a guide passage for receiving the inserted computer motherboard blade, and two clamping spring arms respectively extending from the channel-like mounting frames and suspending in the guide passage for clamping the inserted computer motherboard blade from two opposite sides and constituting with the inserted computer motherboard blade a grounding loop.

摘要翻译： 接地弹簧板安装结构包括安装在用于刀片服务器的壳体内的每个轨道上的金属接地弹簧板，以固定和研磨计算机主板叶片。 金属接地弹簧板具有安装在轨道的凹陷部分中的平坦基座，设置在平坦基座的两侧的两个通道状安装框架，并分别安装在轨道的两个平行轨道上并与平坦基座一起形成导轨 用于接收插入的计算机主板叶片的通道和分别从通道状安装框架延伸并悬挂在引导通道中的两个夹紧弹簧臂，用于将插入的计算机主板叶片从两个相对侧夹持，并且与插入的计算机主板叶片构成接地 循环。

公开(公告)号：US07684198B2

公开(公告)日：2010-03-23

申请号：US12212654

申请日：2008-09-18

申请人： Chih-Liang Fang

发明人： Chih-Liang Fang

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/4006 ,  H01L23/433 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation. Each first heat transfer device comprises a first heat-transfer sheet member having a high heat conductivity and a low thermal resistance and bonded to one first heat generating electronic device, an elastically deformable second heat-transfer sheet member having a low heat conductivity and a high thermal resistance and bonded to the heat plate to compensate for height tolerance of the respective first heat generating electronic device, and a heat-transfer block for spreading heat energy from the first heat-transfer sheet member onto the heat plate through the second heat-transfer sheet member.

摘要翻译： 公开了一种用于散发来自电路板的热量的堆叠传热接口结构，包括固定到电路板的加热板，以及相对较薄的第一传热装置和相对较厚的第二传热装置，其分别附接到第一和第二发热电子 具有不同高度的电路板的装置，用于将热量从电路板的第一和第二发热电子装置传递到散热板。 每个第一传热装置包括具有高导热性和低热阻并且结合到一个第一发热电子装置的第一传热片部件，具有低导热性和高热导率的可弹性变形的第二传热片部件 热电阻并且结合到加热板以补偿各个第一发热电子设备的高度公差，以及传热块，用于通过第二传热将来自第一传热片部件的热能传递到加热板上 片材成员。

公开(公告)号：US20090021914A1

公开(公告)日：2009-01-22

申请号：US11826741

申请日：2007-07-18

申请人： Chih-Liang Fang ,  Yie-Tun Huang

发明人： Chih-Liang Fang ,  Yie-Tun Huang

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.