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    Micromachined hot-wire shear stress sensor
    1.
    发明授权
    Micromachined hot-wire shear stress sensor 失效
    微加工热丝剪切应力传感器

    公开(公告)号：US5883310A

    公开(公告)日：1999-03-16

    申请号：US428334

    申请日：1995-04-25

    申请人： Chih-Ming Ho ,  Yu-Chong Tai ,  Fukang Jiang ,  Chang Liu ,  Jin-Biao Huang

    发明人： Chih-Ming Ho ,  Yu-Chong Tai ,  Fukang Jiang ,  Chang Liu ,  Jin-Biao Huang

    IPC分类号： G01F1/684 ,  G01P5/12 ,  G01B7/16

    CPC分类号： G01P5/12 ,  G01F1/6845

    摘要： A micromachined hot-wire anemometer having fast response times and higher sensitivities than conventional hot-wire anemometers is provided by micromachining doped polysilicon wires carried on silicon supports cantilevered from a substrate including one or more insulating layers disposed between said substrate and supports. The micromachined polysilicon hot-wire anemometer is fabricated using surface micromachining techniques.A shear stress sensor is micromachined to define a thin diaphragm over a cavity defined in a substrate underlying the diaphragm. The cavity is evacuated, sealed, and a thermistor disposed over the diaphragm. The thermistor is thus thermally insulated from the substrate and provides a low profile shear stress sensor for measuring flow rates in boundary layers above a flow surface.

    摘要翻译： 具有比常规热线风速计更快的响应时间和更高灵敏度的微加工热线风速计通过微机械加工在从包括设置在所述衬底和支撑件之间的一个或多个绝缘层悬垂的硅衬底上的掺杂多晶硅线提供。 使用表面微加工技术制造微加工多晶硅热丝风速计。 剪切应力传感器被微加工以在限定在隔膜下方的基板中的空腔上限定薄膜。 空腔被抽真空，密封，并且设置在隔膜上方的热敏电阻。 因此，热敏电阻与基板热绝缘，并提供用于测量流动表面上方边界层中的流速的低剖面剪切应力传感器。

    DRUG-DELIVERY PUMPS AND METHODS OF MANUFACTURE
    8.
    发明申请
    DRUG-DELIVERY PUMPS AND METHODS OF MANUFACTURE 有权
    药物输送泵和制造方法

    公开(公告)号：US20100004639A1

    公开(公告)日：2010-01-07

    申请号：US12463254

    申请日：2009-05-08

    申请人： Changlin Pang ,  Fukang Jiang ,  Jason Shih ,  Sean Caffey ,  Mark Humayun ,  Yu-Chong Tai

    发明人： Changlin Pang ,  Fukang Jiang ,  Jason Shih ,  Sean Caffey ,  Mark Humayun ,  Yu-Chong Tai

    IPC分类号： A61K9/22

    CPC分类号： A61F9/00781 ,  A61F9/0017 ,  A61M5/1408 ,  A61M5/142 ,  A61M5/14276 ,  A61M5/14593 ,  A61M5/16886 ,  A61M39/24 ,  A61M2005/14204 ,  A61M2005/14264 ,  A61M2205/0244 ,  A61M2210/0612 ,  B44C1/227 ,  Y10T156/1092 ,  Y10T156/1093 ,  Y10T307/625

    摘要： Embodiments of an implantable electrolytic pump include an electrolysis chamber, a drug chamber and an osmosis chamber, the osmosis chamber having a first portion in contact with the drug chamber and a second portion exposed to facilitate contact with a surrounding fluid. The pump further includes a cannula for conducting liquid from the drug chamber and electrolysis electrodes within the electrolysis chamber for causing generation of a gas therein, the electrolysis and drug chambers being in contact such that gas electrolysis within electrolysis chamber forces fluid from the drug chamber into the cannula, contact between the drug chamber and the osmosis chamber permitting fluid admitted into the osmotic chamber from the surrounding fluid to offset volume loss from the drug chamber and prevent buildup of vacuum pressure thereon.

    摘要翻译： 可植入电解泵的实施例包括电解室，药物室和渗透室，渗透室具有与药物室接触的第一部分和暴露于便于与周围流体接触的第二部分。 泵还包括用于从药物腔室导出液体的插管和电解室内的电解电极，用于在其中产生气体，电解和药物室接触，使得电解室内的气体电解迫使来自药物室的流体进入 插管，药物室和渗透室之间的接触，允许从周围流体进入渗透室的流体以抵消药物室的体积损失并防止其上的真空压力的累积。

    Flexible skin incorporating MEMS technology
    10.
    发明授权
    Flexible skin incorporating MEMS technology 失效
    柔性皮肤结合MEMS技术

    公开(公告)号：US06953982B1

    公开(公告)日：2005-10-11

    申请号：US09567818

    申请日：2000-05-09

    申请人： Yu-Chong Tai ,  Fukang Jiang ,  Chihming Ho

    发明人： Yu-Chong Tai ,  Fukang Jiang ,  Chihming Ho

    IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01L21/301 ,  H01L29/00

    CPC分类号： B81B7/0077 ,  B81C1/00246 ,  H01L24/24 ,  H01L2224/24137

    摘要： A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1–100 μm thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10–500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).

    摘要翻译： 由聚硅氧烷膜封装的硅岛形成的柔性表皮。 硅岛优选包括MEMS器件，并通过聚酰亚胺膜（优选约1-100μm厚）连接在一起。 为了形成硅岛，通过Si湿式蚀刻将硅晶片蚀刻到所需厚度（优选约10-500μm），然后通过反应离子蚀刻（RIE）从背面图案化。