公开(公告)号：US20100193466A1

公开(公告)日：2010-08-05

申请号：US12411219

申请日：2009-03-25

申请人： Chih-Shueh Shih ,  Chao-Hung Lo ,  Jen-Hui Hsu

发明人： Chih-Shueh Shih ,  Chao-Hung Lo ,  Jen-Hui Hsu

IPC分类号： C23F1/00 ,  B05D5/12 ,  C23C14/34 ,  C25D5/34

CPC分类号： H05K3/427 ,  H05K2201/09563 ,  H05K2203/0361 ,  H05K2203/0384

摘要： A method of manufacturing a circuit board is provided. Firstly, a substrate is provided, and a first conductive layer is disposed on the substrate. Next, a barrier layer is formed on the first conductive layer. Thereafter, a through hole passing through the substrate, the first conductive layer, and the barrier layer is formed. A second conductive layer including a conductive rod disposed in the through hole is formed on an inside wall of the through hole and the barrier layer. After that, parts of the second conductive layer located outside the through hole are removed. Next, the barrier layer is removed, and a circuit layer is formed on the first conductive layer and the conductive rod. Parts of the first conductive layer exposed by the circuit layer are then removed.

摘要翻译： 提供一种制造电路板的方法。 首先，设置基板，在基板上设置第一导电层。 接下来，在第一导电层上形成阻挡层。 此后，形成通过基板，第一导电层和阻挡层的通孔。 包括设置在通孔中的导电棒的第二导电层形成在通孔和阻挡层的内壁上。 之后，去除位于通孔外侧的第二导电层的部分。 接下来，去除阻挡层，并且在第一导电层和导电棒上形成电路层。 然后去除由电路层露出的第一导电层的部分。