公开(公告)号：US20090224380A1

公开(公告)日：2009-09-10

申请号：US12042125

申请日：2008-03-04

申请人： Chin-Fa WANG ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

发明人： Chin-Fa WANG ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

IPC分类号： H01L23/495 ,  H05K7/18

CPC分类号： H01L23/49541 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed oil a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as “S” shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

摘要翻译： 揭示了具有降压挡板的引线架和利用其的半导体封装。 引线框架主要包括形成油的多个引线，第一平面，平行地形成在第二平面上的挡板，以及形成在第一平面和第二平面之间的内部连接杆。 内部连接杆具有至少两个或更多个绕组，例如“S”形，以将挡板板柔性地连接到相邻的引线之间。 因此，内部连接杆可以减少在挡板形成下降期间所连接的引线的移动和扭转。

公开(公告)号：US20090302443A1

公开(公告)日：2009-12-10

申请号：US12133898

申请日：2008-06-05

申请人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

发明人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

IPC分类号： H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die- bonding plane under the chip is desirably prevented.

摘要翻译： 揭示了一种基于引线框架的半导体封装和封装的引线框架。 半导体封装主要包括引线框架的包括一个或多个第一引线，一个或多个第二引线和布置在第一引线和第二引线之间的支撑杆的部分，还包括附接到第一引线，第二引线和 支撑杆，多根接合线和密封剂。 支撑杆具有从第一接合指和第二接合指突起的延伸部分，并且连接到密封剂的非引线侧，其中延伸部具有拱形弯曲部以吸收拉应力并阻止应力传递。 在沿着密封剂的非引线侧修整支撑杆时不会产生由支撑杆分层引起的裂纹。 希望防止沿着支撑杆的裂纹向芯片下方的芯片接合平面的水分渗透。

公开(公告)号：US07812430B2

公开(公告)日：2010-10-12

申请号：US12042125

申请日：2008-03-04

申请人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

发明人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as “S” shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

摘要翻译： 揭示了具有降压挡板的引线架和利用其的半导体封装。 引线框架主要包括形成在第一平面上的多个引线，平行地形成在第二平面上的挡板和形成在第一平面和第二平面之间的内部连接杆。 内部连接杆具有至少两个或更多个绕组，例如“S”形，以将挡板板柔性地连接到相邻的引线之间。 因此，内部连接杆可以减少在挡板形成下降期间所连接的引线的移动和扭转。

公开(公告)号：US07619307B1

公开(公告)日：2009-11-17

申请号：US12133898

申请日：2008-06-05

申请人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

发明人： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.

摘要翻译： 揭示了一种基于引线框架的半导体封装和封装的引线框架。 半导体封装主要包括引线框架的包括一个或多个第一引线，一个或多个第二引线和布置在第一引线和第二引线之间的支撑杆的部分，还包括附接到第一引线，第二引线和 支撑杆，多根接合线和密封剂。 支撑杆具有从第一接合指和第二接合指突起的延伸部分，并且连接到密封剂的非引线侧，其中延伸部具有拱形弯曲部以吸收拉应力并阻止应力传递。 在沿着密封剂的非引线侧修整支撑杆时不会产生由支撑杆分层引起的裂纹。 期望地防止沿支撑杆的裂纹到芯片下方的芯片接合平面的水分渗透。

公开(公告)号：US07564123B1

公开(公告)日：2009-07-21

申请号：US12122937

申请日：2008-05-19

申请人： Chin-Fa Wang ,  Chin-Ti Chen ,  Bing-Shun Yu ,  Wan-Jung Hsieh

发明人： Chin-Fa Wang ,  Chin-Ti Chen ,  Bing-Shun Yu ,  Wan-Jung Hsieh

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a carrying surface and an exposed external surface. The first chip is attached to one surface of the leads. The paddle is attached to an opposing surface of the leads by the adhesive bonding the carrying surface to the leads. Furthermore, the adhesive further encapsulates the gaps between the leads without contaminating the exposed external surface and with the exposed external surface exposed from the encapsulant. Therefore, the leads obtain a better support so that the encapsulated portions of the leads will not shift nor expose from the encapsulant during molding processes without encapsulated bubbles between the leads and the paddle. The heat dissipation is also enhanced.

摘要翻译： 半导体封装主要包括多个引线框的引线，芯片，桨，粘合剂和封装上述组件的密封剂。 桨具有承载表面和暴露的外表面。 第一个芯片连接到引线的一个表面。 通过将承载表面粘合到引线上的粘合剂将桨连接到引线的相对表面。 此外，粘合剂进一步封装引线之间的间隙，而不会污染暴露的外表面，暴露的外表面暴露于密封剂。 因此，引线获得更好的支撑，使得引线的封装部分在模制过程中不会移动或暴露于密封剂，而不会在引线和引脚之间产生封装的气泡。 散热也得到提高。