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公开(公告)号：US20040035706A1
公开(公告)日：2004-02-26
申请号：US10223350
申请日：2002-08-20
发明人： S. J. Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Y. J. Lee
IPC分类号： C25D005/00
CPC分类号： C25D5/022 , C25D5/04 , G01R1/07342 , G01R3/00 , H05K3/241 , H05K3/4007 , H05K2201/0367
摘要： A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.
摘要翻译： 探针卡的探针的方法包括在电镀槽上设置阻挡板。 阻挡板根据探针头上的接触垫的布局具有多个开口。 探针头的接触垫上有凹凸。 凸点（接触垫）可以通过阻挡板的开口接触电镀槽中的电镀溶液，进行连续电镀工艺。 通过根据所需形状的探针连续移动探头，通过电镀形成探针。 这些探针可以制成不同的形状，具有良好的弹性和高度均匀性，以提高晶片探测期间电接触的质量。 此外，节省了处理时间和制造成本。
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公开(公告)号：US20040012405A1
公开(公告)日：2004-01-22
申请号：US10198119
申请日：2002-07-19
发明人： S. J. Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Y. J. Lee
IPC分类号： G01R031/02
CPC分类号： G01R1/07378 , G01R3/00
摘要： A probe card with full wafer contact configuration comprises a back plate and a plurality of modular multiplayer ceramic wiring boards coplanarly mounted on the back plate. The total size of the modular multilayer ceramic wiring boards is larger than that of a wafer under test in order to fully contact all the bonding pads of the wafer under test. The modular multilayer ceramic wiring boards can be manufactured separately according to various locations. Thus, the manufacturing cost is reduced and yield is improved and lead time is shortened.
摘要翻译： 具有全晶片接触构造的探针卡包括背板和共面安装在背板上的多个模块化多层陶瓷布线板。 模块化多层陶瓷布线板的总尺寸大于被测晶圆的总尺寸，以便完全接触被测晶片的所有焊盘。 模块化多层陶瓷布线板可以根据各种不同的位置分开制造。 因此，制造成本降低，产量提高，交货时间缩短。
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