Semiconductor wafer polishing apparatus with a flexible carrier plate
    1.
    发明授权
    Semiconductor wafer polishing apparatus with a flexible carrier plate 失效
    具有柔性载体板的半导体晶片抛光装置

    公开(公告)号:US5851140A

    公开(公告)日:1998-12-22

    申请号:US800941

    申请日:1997-02-13

    CPC分类号: B24B37/30 B24B37/32

    摘要: A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining ring is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of a vacuum and a source of pressurized fluid alternately to be connected to the cavity.

    摘要翻译: 用于半导体晶片抛光装置的载体头包括具有主表面和多个开放流体通道的刚性板。 柔性晶片载体膜具有用于接触半导体晶片的穿孔晶片接触部分和围绕晶片接触部分延伸的波纹管。 保持环被固定到刚性板上,其中凸缘夹在板的主表面和保持环之间的波纹管上,从而在晶片载体膜和刚性板之间形成空腔。 流体导管联接到刚性板,允许真空源和加压流体源交替地连接到空腔。

    Robot arm edge gripping device for handling substrates
    2.
    发明授权
    Robot arm edge gripping device for handling substrates 有权
    用于处理基材的机器人手臂边缘夹紧装置

    公开(公告)号:US06913302B2

    公开(公告)日:2005-07-05

    申请号:US10121152

    申请日:2002-04-11

    IPC分类号: H01L21/687 B66C1/42

    CPC分类号: H01L21/68707 Y10S294/907

    摘要: An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted. The lever arms are pivotally mounted with flexural pivot members having no sliding motion, to minimize particle generation.

    摘要翻译: 边缘夹持装置夹住并脱离诸如半导体晶片的衬底。 刀片从远离设备的底部延伸。 至少一个远端接触构件设置在叶片的尖端处。 两个近侧杠杆臂可枢转地连接,用于与底座同步的相对定向的旋转。 每个杠杆臂在外端具有至少一个近端接触构件。 偏置构件联接到两个近侧杆臂和致动器以实现杠杆臂的枢转运动。 枢转运动使臂的端部大致径向地朝向和远离衬底的中心移动以被夹持或未被夹持,从而最小化衬底的滑动。 偏置构件被偏置以在断电的情况下将杠杆臂保持在关闭位置。 每个接触件旁边都设有斜面。 接触构件和斜面被成型以最小化接触的衬底边缘的区域。 杠杆臂枢转地安装有没有滑动运动的弯曲枢转构件,以最小化颗粒的产生。

    Robot arm edge gripping device for handling substrates using two four-bar linkages
    4.
    发明授权
    Robot arm edge gripping device for handling substrates using two four-bar linkages 有权
    使用两个四杆连杆处理基板的机器人手臂边缘夹紧装置

    公开(公告)号:US06623235B2

    公开(公告)日:2003-09-23

    申请号:US10120673

    申请日:2002-04-11

    IPC分类号: B25J1500

    CPC分类号: H01L21/68707

    摘要: An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mechanism. The linkage mechanism includes two four-bar linkages. The first four-bar linkage has a stationary link and three movable links connected in a parallelogram configuration. The pusher bar is fixed to one of the movable links of the first linkage for movement therewith. The second four-bar linkage has a stationary link and three movable links connected in a trapezoidal configuration. The blade is fixed to one of the movable links of the second linkage for movement therewith. The two linkages share a stationary pivot point. An actuator having one end fixed with respect to the first linkage and an opposite end fixed with respect to the second linkage is operative to move the first linkage and the second linkage. The proximal contact location moves substantially horizontally and the distal contact location moves vertically and horizontally.

    摘要翻译: 用于机器人手臂的边缘夹紧装置夹住并脱离诸如半导体晶片的衬底。 基座固定在机器人手臂的一端。 在其上具有远端接触位置的叶片和其上具有优选地两个近端接触位置的推杆通过连杆机构可移动地安装到基座。 连杆机构包括两个四杆连杆。 第一个四杆联动装置具有固定连杆和三个以平行四边形配置连接的可移动连杆。 推杆固定到第一连杆的可移动连杆中的一个以与其一起运动。 第二个四杆联动装置具有固定连杆和三个以梯形构造连接的可移动连杆。 刀片被固定到第二连杆的可移动连杆中的一个以与其一起运动。 两个联动共享一个固定的枢轴点。 具有相对于第一连杆固定的一端和相对于第二连杆固定的相对端的致动器可操作以移动第一连杆机构和第二连杆机构。 近端接触位置大致水平移动,远端接触位置垂直和水平移动。

    Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
    5.
    发明授权
    Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure 失效
    具有直接气相晶片抛光压力的化学机械抛光(CMP)头的装置和方法

    公开(公告)号:US06368189B1

    公开(公告)日:2002-04-09

    申请号:US09390142

    申请日:1999-09-03

    IPC分类号: B24B100

    摘要: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

    摘要翻译: 联接弹性气动环形密封囊,用于与第一加压气动流体的流体连通以限定第一气动区,并且附接到邻近保持环内圆柱形表面的晶片止挡板的第一表面以接收晶片并支撑 晶圆在外围边缘。 弹性气动环形密封囊限定了第一气动区域的径向内部的第二气动区域,并且在抛光操作期间当晶片被附接到抛光头时在晶片止挡板的第一表面和晶片之间延伸,并且连接到流体 与第二加压气动流体的通信。 晶片附着停止板在非抛光期间是可操作的,以防止晶片在晶片装载和卸载操作期间用于将晶片保持在抛光头上的施加的真空力过度地弯曲。