公开(公告)号：US06639486B2

公开(公告)日：2003-10-28

申请号：US10104928

申请日：2002-03-22

Applicant: Christopher M. Buck

Inventor： Christopher M. Buck

IPC: H01P5107

CPC classification number: H01P5/107

Abstract: A transition from microstrip to waveguide comprises a rectangular waveguide and a microstrip structure formed by a resilient substrate (24) having a stripline (26) on one surface and a ground plane (44) on an opposite surface, the conductors (26, 44) being interconnected by viaholes. The substrate (24) is disposed between the side walls (36) and the floor (22) of the waveguide with the ground plane contacting the floor. The stripline extends from one end of the waveguide along a portion of its length. A tapered ridge (38) depends from the ceiling (34) of the waveguide and extends from the other end of the waveguide. A terminal end (40) of the ridge contacts a terminal portion of the stripline under mechanical pressure. The ridge (38) may have a choice of profiles such as triangular, half cosine and half cosine with a semicircular cut-out in the upright edge.

公开(公告)号：US07064632B2

公开(公告)日：2006-06-20

申请号：US10988152

申请日：2004-11-12

Applicant: Christopher M. Buck ,  Keith R. Williams

Inventor： Christopher M. Buck ,  Keith R. Williams

IPC: H01P1/203

CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P1/047 ,  H01P1/20363 ,  H01P5/107 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4688 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2203/049 ,  H01L2924/00014

Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.

Abstract translation: 微波电路包括印刷电路板（PCB），其上制造了包括诸如由印刷导电图案形成的滤光器（40）的无源部件的电路。 为了提高电路的性能，在诸如氧化铝的基板材料（41）具有比印刷电路板材料更高的介电常数的基板材料（41）上更精确地制造诸如滤光片的选定部件。 完成的部件安装在印刷电路板上，并且导电图案通过引线接合（48,50）连接到印刷电路板的微带轨道（51）。

公开(公告)号：US06833775B2

公开(公告)日：2004-12-21

申请号：US10114498

申请日：2002-04-02

Applicant: Christopher M. Buck ,  Keith R. Williams

Inventor： Christopher M. Buck ,  Keith R. Williams

IPC: H01P1203

CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P1/047 ,  H01P1/20363 ,  H01P5/107 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4688 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2203/049 ,  H01L2924/00014

Abstract: A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.

Abstract translation: 微波电路包括印刷电路板（PCB），其上制造了包括诸如由印刷导电图案形成的滤光器（40）的无源部件的电路。 为了提高电路的性能，在诸如氧化铝的基板材料（41）具有比印刷电路板材料更高的介电常数的基板材料（41）上更精确地制造诸如滤光片的选定部件。 完成的部件安装在印刷电路板上，并且导电图案通过引线接合（48,50）连接到印刷电路板的微带轨道（51）。