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1.发明授权Micromechanical contact load force sensor for sensing magnitude and distribution of loads and tool employing micromechanical contact load force sensor 失效用于感测负载的大小和分布的微机械接触载荷力传感器以及采用微机械接触载荷力传感器的工具
公开(公告)号：US5656785A
公开(公告)日：1997-08-12
申请号：US511658
申请日：1995-08-07
IPC分类号： A61B19/00 , A61F2/38 , A61F2/46 , A61F2/50 , A61F2/58 , A61F2/70 , A61F2/76 , B25J13/08 , G01L1/14 , G01L5/22 , G01D7/00 , G01L3/00
CPC分类号： G01L1/146 , A61F2/4657 , B25J13/084 , G01L1/148 , G01L5/228 , A61B2090/064 , A61F2/3859 , A61F2/389 , A61F2/461 , A61F2/583 , A61F2/586 , A61F2002/4624 , A61F2002/4666 , A61F2002/5061 , A61F2002/704 , A61F2002/7635
摘要： A micromechanical contact load force sensor is disclosed. The force sensor comprises an array of capacitive load cells on a substrate. The force sensor is able to sense high loads, on the order on 10.sup.9 N/m.sup.2, and distribute the load over a suitable number of the cells of the array while minimizing crosstalk between adjacent cells. The force sensor is useful in biological and robotic applications.
摘要翻译： 公开了一种微机械接触载荷力传感器。 力传感器包括在衬底上的电容式负载单元的阵列。 力传感器能够以109 N / m2的顺序感测高负载，并将负载分布在阵列的适当数量的单元上，同时最小化相邻单元之间的串扰。 力传感器可用于生物和机器人应用。
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2.发明授权Trenches to reduce charging effects and to control out-of-plane sensitivities in tuning fork gyroscopes and other sensors 失效减少充电效应和控制音叉陀螺仪和其他传感器的平面外灵敏度的沟槽
公开(公告)号：US5952574A
公开(公告)日：1999-09-14
申请号：US841224
申请日：1997-04-29
申请人： Marc S. Weinberg , Steven T. Cho , Ralph E. Hopkins, III , Lance C. Niles , Anthony S. Kourepenis , Eric M. Hildebrant , Paul A. Ward
发明人： Marc S. Weinberg , Steven T. Cho , Ralph E. Hopkins, III , Lance C. Niles , Anthony S. Kourepenis , Eric M. Hildebrant , Paul A. Ward
IPC分类号： G01C19/5719 , G01C19/00
CPC分类号： G01C19/5719
摘要： Trenches which reduce or eliminate force and sensitivity associated with proof mass motion normal to the substrate as a result of voltage transients is disclosed. The trenches provide increased separation between interleaved comb electrodes and the substrate, and thereby also reduce the comb lift to drive ratio. The trenches are typically formed directly below the interleaved comb electrodes, but may also be formed below other suspended portions. Trench depth is from 6-10 microns and provides a comb electrode to substrate separation of approximately 8.5-12.5 microns.
摘要翻译： 公开了减少或消除由于电压瞬变而与基板垂直的质量运动相关联的力和灵敏度的沟槽。 沟槽提供了交错的梳状电极和衬底之间的增加的分离，从而也将梳子升高减小到驱动比。 沟槽通常直接形成在交错梳状电极的正下方，但也可以形成在其它悬置部分的下面。 沟渠深度为6-10微米，并提供梳状电极至约8.5-12.5微米的基底分离。
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