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公开(公告)号:US11774244B2
公开(公告)日:2023-10-03
申请号:US17515271
申请日:2021-10-29
申请人: Analog Devices, Inc.
发明人: Jeffrey A. Gregory , Charles Blackmer , Tyler Adam Dunn , Eugene Oh Hwang , Jinbo Kuang , Kemiao Jia , Laura Cornelia Popa , Igor P. Prikhodko , Erdinc Tatar
IPC分类号: G01C19/5747 , G01C19/5712 , G01C19/5719 , G01C19/574
CPC分类号: G01C19/5747 , G01C19/574 , G01C19/5712 , G01C19/5719
摘要: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
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公开(公告)号:US11703330B2
公开(公告)日:2023-07-18
申请号:US16836387
申请日:2020-03-31
IPC分类号: G01C19/5719 , B81C1/00 , H03H3/007 , H03H9/10 , B81B3/00 , G01C19/5691 , B81B7/00
CPC分类号: G01C19/5719 , B81C1/00182 , H03H3/0072 , H03H9/1057 , B81B3/0051 , B81B7/0016 , B81B2201/0242 , B81B2201/0271 , B81B2203/0127 , B81B2203/0172 , B81C1/00158 , G01C19/5691
摘要: A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.
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公开(公告)号:US20180273374A1
公开(公告)日:2018-09-27
申请号:US15650812
申请日:2017-07-14
申请人: InvenSense, Inc.
发明人: William Kerry Keal
IPC分类号: B81C1/00 , G01C19/5719 , G01P1/02 , G01P15/08 , G01P15/125 , G01P15/18 , H01H59/00 , H03H9/10
CPC分类号: B81C1/0023 , B81B2201/0235 , B81B2201/042 , B81C2201/019 , B81C2203/0118 , G01C19/5719 , G01K11/24 , G01K13/02 , G01P1/023 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0831 , H01H59/0009 , H03H9/1057
摘要: In a method of inferring ambient atmospheric temperature, an acoustic signal is emitted from a speaker. A first sample of the acoustic signal is captured with a first microphone spaced a first distance from the speaker. A second sample of the acoustic signal is captured with a second microphone spaced a second distance from the speaker. The second distance is greater than the first distance, and a difference between the first distance and the second distance is a known third distance. A time delay in the acoustic signal is determined between the first sample and the second sample. An ambient temperature of the atmosphere through which the acoustic signal traveled is inferred based on a relationship between the time delay and temperature for the acoustic signal over the third distance.
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公开(公告)号:US20180209790A1
公开(公告)日:2018-07-26
申请号:US15742756
申请日:2016-05-24
申请人: Robert Bosch GmbH
IPC分类号: G01C19/5733
CPC分类号: G01C19/5733 , B81B2201/025 , G01C19/5719
摘要: A rotation rate sensor including a substrate having a principal plane of extension, and a structure movable with respect to the substrate; the structure being excitable from a neutral position into an oscillation having a movement component substantially parallel to a driving direction, which is substantially parallel to the principal plane of extension. To induce the oscillation, the rotation rate sensor includes a comb electrode moved along with the structure and a comb electrode fixed in position relative to the substrate. The excitation is produced by applying a voltage to the moving comb electrode and/or to the stationary comb electrode. Due to a rotation rate of the rotation rate sensor about an axis running substantially perpendicularly to the driving direction and substantially perpendicularly to the detection direction, a force applied to the structure with a force component along a detection direction substantially perpendicular to the driving direction is detectable.
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公开(公告)号:US09909874B2
公开(公告)日:2018-03-06
申请号:US14783792
申请日:2014-04-07
申请人: Robert Bosch GmbH
发明人: Jochen Reinmuth
IPC分类号: G01C19/56 , G01C19/5712 , G01C19/5719 , G01C19/574
CPC分类号: G01C19/5712 , G01C19/5719 , G01C19/574
摘要: A micromechanical rotation rate sensor includes: a substrate having a main plane of extension; a first Coriolis element; a second Coriolis element; a drive device for deflecting the first and second Coriolis elements from a neutral position; and a detection device. The first Coriolis element, with regard to a first axis extending in parallel to the main plane of extension, has a mass-symmetrical design with respect to the second Coriolis element. The first and second Coriolis elements have a common main plane of extension, and in the neutral position the shared main plane of extension extends in parallel to the main plane of extension of the substrate. The first and second Coriolis elements each have a mass-symmetrical design with respect to a second axis extending perpendicularly with respect to the first axis. The first and second Coriolis elements are drivable by the drive device.
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公开(公告)号:US09885577B2
公开(公告)日:2018-02-06
申请号:US14814016
申请日:2015-07-30
申请人: INVENSENSE, INC.
发明人: Vadim Tsinker
IPC分类号: G01C19/56 , G01C19/5776 , G01C19/5719
CPC分类号: G01C19/5776 , G01C19/5719
摘要: Reducing noise from drive tone and sense resonance peaks of a micro-electro-mechanical system (MEMS) gyroscope output using a notch filter is presented herein. The MEMS gyroscope can include a drive oscillation component configured to vibrate a sensor mass at a drive resonance frequency; a sense circuit configured to detect a deflection of the sensor mass, and generate, based on the deflection and the drive resonance frequency, a demodulated output; and a signal processing component configured to receive a set of frequencies comprising a first value representing the drive resonance frequency and a second value corresponding to a sense resonance frequency associated with the sense circuit, and apply, based on the first value and the second value, a notch filter to the demodulated output to obtain a filtered output.
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公开(公告)号:US20180003502A1
公开(公告)日:2018-01-04
申请号:US15444272
申请日:2017-02-27
IPC分类号: G01C19/5712
CPC分类号: G01C19/5712 , G01C19/56 , G01C19/5719 , G01C19/5755 , G01C19/5762 , G01P15/125
摘要: According to one embodiment, an angular velocity acquisition device includes a movable body that vibrates in a first direction and in a second direction that is based on Coriolis force and includes a movable electrode portion extending in the second direction, a hold electrode that extends in the second direction and includes a fixed electrode portion opposite to the movable electrode portion across a gap, and a stopper that is provided between the fixed electrode portion and the movable electrode portion and includes an end portion closer to the movable electrode portion than a surface of the fixed electrode portion facing the movable electrode portion.
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公开(公告)号:US09791274B2
公开(公告)日:2017-10-17
申请号:US14171691
申请日:2014-02-03
IPC分类号: G01C19/5719 , B81B3/00 , G01P15/08 , G01P15/125 , G01P15/18
CPC分类号: G01C19/5719 , B81B3/0062 , B81B2201/0242 , G01P15/08 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/082
摘要: MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.
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公开(公告)号:US09746490B2
公开(公告)日:2017-08-29
申请号:US14817324
申请日:2015-08-04
发明人: Satoru Tanaka
IPC分类号: G01P15/125 , G01C19/56 , G01C19/5719 , B81B3/00 , G01P15/08
CPC分类号: G01P15/125 , B81B3/0013 , B81B2201/0235 , B81B2201/0242 , B81B2201/033 , B81B2207/097 , B81C2203/0109 , B81C2203/031 , G01C19/5719 , G01P2015/0814
摘要: A physical quantity sensor includes: a base substrate; a movable portion; a plurality of movable electrode fingers which are provided in the movable portion; a fixed electrode finger which is provided on the base substrate; and a fixing portion which fixes the movable portion to the base substrate. In the movable electrode fingers, a movable electrode finger which opposes the fixing portion in the first direction is included. A clearance between the movable electrode finger and the fixing portion is smaller than a clearance between the movable electrode finger and the fixed electrode finger. The width of the movable electrode finger is greater than the width of other movable electrode finger.
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公开(公告)号:US09738510B1
公开(公告)日:2017-08-22
申请号:US14750820
申请日:2015-06-25
申请人: mCube, Inc.
发明人: Chien Chen Lee
CPC分类号: B81C1/00134 , B81B3/0035 , B81B3/0062 , B81B3/0072 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/012 , B81C1/00158 , B81C1/0023 , B81C2203/0792 , G01C19/5719 , G01C19/5783 , G01L9/0042 , G01L19/147 , H04R31/00 , H04R2201/003
摘要: A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
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