公开(公告)号：US08059410B2

公开(公告)日：2011-11-15

申请号：US12504682

申请日：2009-07-17

申请人： Chun-Chi Chen ,  Hong-Cheng Yang ,  Cheng Kong ,  Wei-Cheng Nie

发明人： Chun-Chi Chen ,  Hong-Cheng Yang ,  Cheng Kong ,  Wei-Cheng Nie

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S292/16 ,  Y10T24/44538 ,  H01L2924/00

摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.

摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 一对接合部从导热板的顶面朝向彼此突出。 夹子将热管固定到导热板的顶面。 夹子包括枢转地固定到导热板的枢转部分，可拆卸地与接合部分接合的夹紧部分，以及将枢转部分和夹紧部分相互连接并与导热管抵接导热的主体 板。

公开(公告)号：US20100258277A1

公开(公告)日：2010-10-14

申请号：US12504682

申请日：2009-07-17

申请人： Chun-Chi Chen ,  Hong-Cheng Yang ,  Cheng Kong ,  Wei-Cheng Nie

发明人： Chun-Chi Chen ,  Hong-Cheng Yang ,  Cheng Kong ,  Wei-Cheng Nie

IPC分类号： F28D15/04 ,  F28F7/00

CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S292/16 ,  Y10T24/44538 ,  H01L2924/00

摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.

摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 一对接合部从导热板的顶面朝向彼此突出。 夹子将热管固定到导热板的顶面。 夹子包括枢转地固定到导热板的枢转部分，可拆卸地与接合部分接合的夹紧部分，以及将枢转部分和夹紧部分相互连接并与导热管抵接导热的主体 板。

公开(公告)号：US20100172094A1

公开(公告)日：2010-07-08

申请号：US12417663

申请日：2009-04-03

申请人： Cheng Kong ,  Hong-Cheng Yang

发明人： Cheng Kong ,  Hong-Cheng Yang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.

摘要翻译： 散热装置包括散热器，安装在散热器顶部的风扇和与散热器枢转接合并将风扇朝向散热器推压的电线夹。 散热器包括基座和从基座延伸的多个翅片。 风扇包括支架。 夹子包括枢转地与散热片的翅片接合的枢转部分，与枢转部分的端部连接的接合部分和从枢转部分的另一端延伸的操作部分。 操作部分被向下按压以与散热器接合并且使得接合部分朝向风扇旋转，并将风扇的支架压向散热器，从而将风扇固定到散热器。

公开(公告)号：US07869212B2

公开(公告)日：2011-01-11

申请号：US12417663

申请日：2009-04-03

申请人： Cheng Kong ,  Hong-Cheng Yang

发明人： Cheng Kong ,  Hong-Cheng Yang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.

摘要翻译： 散热装置包括散热器，安装在散热器顶部的风扇，以及与散热器枢转接合并将风扇朝向散热器按压的电线夹。 散热器包括基座和从基座延伸的多个翅片。 风扇包括支架。 夹子包括枢转地与散热片的翅片接合的枢转部分，与枢转部分的端部连接的接合部分和从枢转部分的另一端延伸的操作部分。 操作部分被向下按压以与散热器接合并且使得接合部分朝向风扇旋转，并将风扇的支架压向散热器，从而将风扇固定到散热器。

公开(公告)号：US08235095B2

公开(公告)日：2012-08-07

申请号：US12409516

申请日：2009-03-24

申请人： Cheng Kong

发明人： Cheng Kong

IPC分类号： F28F7/00 ,  H01L23/467 ,  H05K7/20 ,  F01D5/08 ,  F01D25/26

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan mounted on a side of the heat sink, and an engaging portion pivotally engaging with the heat sink and connecting the fan and the heat sink. The fan includes a bracket. A mounting plate with a mounting hole is formed by the bracket. The engaging portion includes a pivot portion pivotally engaging with the heat sink and a pressing portion extending from the pivot portion. A protruded portion extends downwardly from a bottom surface of the pressing portion. The pressing portion presses the mounting portion of the bracket of the fan and the protruded portion engages in the mounting hole of the mounting portion.

摘要翻译： 散热装置包括散热器，安装在散热器侧的风扇以及与散热器枢转接合并且连接风扇和散热器的接合部分。 风扇包括支架。 具有安装孔的安装板由支架形成。 接合部分包括与散热器枢转接合的枢转部分和从枢转部分延伸的按压部分。 突出部分从按压部分的底表面向下延伸。 按压部按压风扇的支架的安装部，突出部卡合在安装部的安装孔内。

公开(公告)号：US20100155022A1

公开(公告)日：2010-06-24

申请号：US12409516

申请日：2009-03-24

申请人： Cheng Kong

发明人： Cheng Kong

IPC分类号： F28F13/00

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan mounted on a side of the heat sink, and an engaging portion pivotally engaging with the heat sink and connecting the fan and the heat sink. The fan includes a bracket. A mounting plate with a mounting hole is formed by the bracket. The engaging portion includes a pivot portion pivotally engaging with the heat sink and a pressing portion extending from the pivot portion. A protruded portion extends downwardly from a bottom surface of the pressing portion. The pressing portion presses the mounting portion of the bracket of the fan and the protruded portion engages in the mounting hole of the mounting portion.

摘要翻译： 散热装置包括散热器，安装在散热器侧的风扇以及与散热器枢转接合并且连接风扇和散热器的接合部分。 风扇包括支架。 具有安装孔的安装板由支架形成。 接合部分包括与散热器枢转接合的枢转部分和从枢转部分延伸的按压部分。 突出部分从按压部分的底表面向下延伸。 按压部按压风扇的支架的安装部，突出部卡合在安装部的安装孔内。