摘要:
A kit for producing a foamed biocompatible material includes a container configured to sustain a high pressure, and a tissue-repair composition placed in the container. The composition contains a biocompatible material, a liquid carrier, and a gas. The container has an internal pressure of greater than 1 atm and less than 250 atm, and includes a valve and a nuzzle for releasing from the nuzzle a foam formed of the composition upon opening the valve. Methods of producing and applying the biocompatible material are also disclosed.
摘要:
A kit for producing a foamed biocompatible material includes a container configured to sustain a high pressure, and a tissue-repair composition placed in the container. The composition contains a biocompatible material, a liquid carrier, and a gas. The container has an internal pressure of greater than 1 atm and less than 250 atm, and includes a valve and a nozzle for releasing from the nozzle a foam formed of the composition upon opening the valve. Methods of producing and applying the biocompatible material are also disclosed.
摘要:
An artificial dura biomedical device and a brain surgery method utilizing the same are disclosed. The steps includes: fixing an artificial dura to a partial skull; and fixing the partial skull with the artificial dura to a cut hole of a whole skull. The artificial dura biomedical device includes an artificial dura and a connecting element. The connecting element fixes the partial skull with the artificial dura.
摘要:
An artificial dura biomedical device and a brain surgery method utilizing the same are disclosed. The steps includes: fixing an artificial dura to a partial skull; and fixing the partial skull with the artificial dura to a cut hole of a whole skull. The artificial dura biomedical device includes an artificial dura and a connecting element. The connecting element fixes the partial skull with the artificial dura.
摘要:
A semiconductor apparatus with a modified pipe support. The apparatus comprises an outer pipe, an inner pipe, and a pipe support. The support comprises a seat and a support ring. The seat comprises a tubular portion for supporting an outer pipe at a top end. The support ring is detachably disposed within the tubular portion and comprises am annular surface and an inner bore surface, wherein the annular surface is inclined to the inner bore surface by an acute angle.
摘要:
A semiconductor apparatus with a modified pipe support. The apparatus comprises an outer pipe, an inner pipe, and a pipe support. The support comprises a seat and a support ring. The seat comprises a tubular portion for supporting an outer pipe at a top end. The support ring is detachably disposed within the tubular portion and comprises am annular surface and an inner bore surface, wherein the annular surface is inclined to the inner bore surface by an acute angle.