-
公开(公告)号:US20100283141A1
公开(公告)日:2010-11-11
申请号:US12463431
申请日:2009-05-11
申请人: Chun-Wei Chang , Tung-Hsien Hsieh , Chia-Hui Liu
发明人: Chun-Wei Chang , Tung-Hsien Hsieh , Chia-Hui Liu
IPC分类号: H01L23/49
CPC分类号: H01L23/49541 , H01L23/3107 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48644 , H01L2224/48664 , H01L2224/85444 , H01L2224/85464 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor chip package includes a chip; first and second connection pads arranged in a matrix and disposed about the chip, and the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body.
摘要翻译: 半导体芯片封装包括芯片; 第一和第二连接焊盘,其布置成矩阵并围绕芯片设置,并且当从QFN封装的底部观察时,第一和第二连接焊盘具有不同的底表面形状; 接合焊盘,设置在芯片的有源表面上,并通过接合线与对应的所述连接焊盘电连接; 以及封装体,其包封芯片,接合线和每个连接焊盘的上部,使得每个连接焊盘的下部从封装主体的底部向外延伸。