Section forming method & construction for wafer ingot growth
    2.
    发明申请
    Section forming method & construction for wafer ingot growth 审中-公开
    晶圆锭生长的截面成形方法与结构

    公开(公告)号:US20070119366A1

    公开(公告)日:2007-05-31

    申请号:US11508864

    申请日:2006-08-24

    IPC分类号: C30B7/00 C30B17/00 C30B21/02

    摘要: A method and construction of growing wafer ingot by having a thermal shield disposed on an opening of a crucible, an opening approximating a polygonal contour disposed on the thermal shield to control gas current, heat conduction and heat radiation in ingot growth, an isotherm of condensation temperature in ingot growth approaching a polygonal form to grow the ingot into a form approximating the preset sectional form of a polygon for minimizing the material to be cut off in the subsequent process of slicing wafer ingot into chips.

    摘要翻译: 通过将坩埚上的热屏蔽设置在坩埚的开口上的近似多边形轮廓的开口,以控制锭生长中的气流,热传导和热辐射,冷凝等温线,生长晶圆锭的方法和结构 晶锭生长中的温度接近多边形,以使锭生长成近似于多边形的预设截面形状的形式,以使在将晶片锭切片成芯片的后续过程中要切断的材料最小化。