公开(公告)号：US10455309B2

公开(公告)日：2019-10-22

申请号：US15538567

申请日：2015-12-04

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Tsjerk Hoekstra ,  David Talmage Patten

IPC: H04R1/00 ,  H04R1/04 ,  H04R1/28 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  H04R1/34

Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).

公开(公告)号：US10334339B2

公开(公告)日：2019-06-25

申请号：US15538584

申请日：2015-12-04

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： John Laurence Pennock ,  Tsjerk Hoekstra ,  David Talmage Patten

IPC: H04R19/00 ,  H04R1/04 ,  H04R1/28 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  H04R1/34

Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.

公开(公告)号：US10117028B2

公开(公告)日：2018-10-30

申请号：US15417507

申请日：2017-01-27

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： David Talmage Patten ,  Tsjerk Hans Hoekstra

IPC: H04R19/04 ,  H04R1/04 ,  B81B3/00 ,  H04R19/00 ,  B81B7/00

Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).