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公开(公告)号:US20250047275A1
公开(公告)日:2025-02-06
申请号:US18364027
申请日:2023-08-02
Inventor: Malcolm BLYTH , Ross C. MORGAN , Michael ROBINSON
IPC: H03K17/082 , H04R3/00 , H04R29/00
Abstract: This application relates to methods and apparatus for current monitoring in switched mode drivers. A switching driver has an output stage with a network of switches for switching an output node between different switching voltages and a modulator for controlling a duty-cycle of the switching output stage based on the input signal, where the modulator generates a modulator signal based on the input signal. A current monitor is configured to receive a first current signal indicative of a sensed first driver current and to determine and/or limit a second driver current using the first current signal and the modulator signal. One of the first driver current and the second driver current is an output current to the load and the other of the first driver current and the second driver current is an input current from a power supply.
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公开(公告)号:US20250070795A1
公开(公告)日:2025-02-27
申请号:US18455313
申请日:2023-08-24
Inventor: Ross C. MORGAN , Michael ROBINSON
Abstract: This application relates to methods and apparatus for voltage monitoring of switching drivers. A modulator is configured to receive a modulator input signal and to controlling switching of an output stage of the switching driver to generate a first drive signal. A voltage monitor is configured to receive a first digital signal tapped from the modulator and to generate an indication of output voltage of the first drive signal from the first digital signal by controllably applying an adjustment from the first digital signal to compensate for inaccuracy between the first digital signal and the output voltage. The adjustment is based on monitored operation of the modulator. In some cases the monitored operation may be clipping of the switching driver. In some cases the monitored operation may be a signal generated by the modulator that include a contribution from a feedback signal of output voltage.
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公开(公告)号:US20250119110A1
公开(公告)日:2025-04-10
申请号:US18482290
申请日:2023-10-06
Inventor: John P. LESSO , Michael ROBINSON
IPC: H03F3/217
Abstract: A modulator integrated circuit (IC) package comprising: signal modulator circuitry; and power modulator circuitry, wherein the signal modulator circuitry is configured to receive an input signal and to supply a modulated output signal to output stage circuitry external to the modulator IC package, and wherein the power modulator circuitry is configured to control power converter circuitry, external to the modulator IC package, operative to provide a supply voltage to the output stage circuitry.
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公开(公告)号:US20240283237A1
公开(公告)日:2024-08-22
申请号:US18413633
申请日:2024-01-16
Inventor: Michael ROBINSON , Ross C. MORGAN , Graham G. MACKAY , Neil WHYTE
IPC: H02H3/24 , G01R31/327 , G01R31/64 , H03K17/687
CPC classification number: H02H3/24 , H03K17/6871 , G01R31/3277 , G01R31/64
Abstract: An integrated circuit (IC) comprising: control circuitry operable to control: an external switch of a primary current path for an energy storage component of a circuit, wherein the external switch of the primary current path is external to the IC; a first internal switch of a secondary current path for the energy storage element, wherein the first internal switch is internal to the IC, wherein the IC is operable in: a first mode in which the first internal switch of the secondary current path is actuated to enable the secondary current path; and a second mode in which the external switch of the primary current path is actuated to enable the primary current path.
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公开(公告)号:US20230328439A1
公开(公告)日:2023-10-12
申请号:US18188112
申请日:2023-03-22
Inventor: Ross C. MORGAN , Michael ROBINSON , Itisha TYAGI
Abstract: An integrated circuit (IC), comprising: a first transducer driver for driving a first transducer; a second transducer driver for driving a second transducer; and boost circuitry comprising first and second boost nodes, the boost converter configurable to boost a supply voltage received at one or more input pins of the IC to provide first and second boosted voltages to respective first and second transducer drivers via respective first and second boost nodes.
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