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公开(公告)号：US20170059148A1
公开(公告)日：2017-03-02
申请号：US15349547
申请日：2016-11-11
Applicant: Cooper Technologies Company
Inventor： Christopher Ladewig , Christopher Michael Bryant , Philip Dean Winters
IPC: F21V29/73 , F21V29/76 , F21V15/01 , F21S2/00 , F21V29/71 , F21S8/08 , F21V29/83 , F21V29/503 , F21V29/508
CPC classification number: F21V29/73 , F21S2/00 , F21S2/005 , F21S8/026 , F21S8/085 , F21S8/086 , F21V15/013 , F21V29/503 , F21V29/508 , F21V29/713 , F21V29/763 , F21V29/83 , F21W2111/02 , F21W2111/023 , F21W2131/103 , F21Y2101/00 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , Y10T29/49002
Abstract: A modular lighting system may include a support structure, a plurality of heat sink modules physically supported by the support structure, and one or more light source modules coupled to the plurality of heat sink modules. The plurality of heat sink modules may be arranged in a modular manner such that the number of heat sink modules in the modular lighting system is variable, and each heat sink module may be an integral molded structure defining at least one opening or passageway.
Abstract translation: 模块化照明系统可以包括支撑结构，由支撑结构物理支撑的多个散热器模块以及耦合到多个散热器模块的一个或多个光源模块。 多个散热器模块可以以模块化方式布置，使得模块化照明系统中的散热器模块的数量是可变的，并且每个散热器模块可以是限定至少一个开口或通道的整体模制结构。
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公开(公告)号：USD844877S1
公开(公告)日：2019-04-02
申请号：US29603040
申请日：2017-05-05
Applicant: Cooper Technologies Company
Designer： Christopher Ladewig
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公开(公告)号：USD823517S1
公开(公告)日：2018-07-17
申请号：US29603043
申请日：2017-05-05
Applicant: Cooper Technologies Company
Designer： Christopher Ladewig
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公开(公告)号：USD793601S1
公开(公告)日：2017-08-01
申请号：US29574952
申请日：2016-08-19
Applicant: Cooper Technologies Company
Designer： Christopher Ladewig , Timothy Wright
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公开(公告)号：US09605830B1
公开(公告)日：2017-03-28
申请号：US14828362
申请日：2015-08-17
Applicant: Cooper Technologies Company
Inventor： Philip Dean Winters , Hung Dinh , Reed Alan Bradford , Sylvia Herman , Christopher Ladewig
IPC: F21V1/00 , F21V11/00 , F21V5/00 , F21V7/00 , F21V11/14 , F21V13/04 , F21V17/10 , F21Y101/02 , F21Y105/00
CPC classification number: F21V5/007 , F21S8/036 , F21S8/063 , F21V5/002 , F21V7/0016 , F21V7/0066 , F21V11/14 , F21V13/04 , F21V17/101 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , G02B6/0001 , G02B19/0028 , G02B19/0066
Abstract: Systems, methods, and devices for reducing glare or pixilation associated with LEDs are disclosed. The disclosure relates to a light module that includes a cover panel that reduces contrast in the light emitted by LEDs. The cover panel can be mounted on a substrate which can include a plurality of LEDs. Apertures in the cover panel are aligned with each of the LEDs and any optic that may be disposed over each LED. A first portion of the light emitted from the LEDs passes through the optic only and into the environment to be illuminated. A second portion of the light emitted from the LEDs passes through both the optic and the cover panel before passing into the environment to be illuminated. The cover panel can be diffuse and can include various characteristics including textures, objects, and angled surfaces that assist in scattering light.
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Patent Agency Ranking
公开(公告)号：US20180195707A1
公开(公告)日：2018-07-12
申请号：US15868834
申请日：2018-01-11
Applicant: Cooper Technologies Company
Inventor： Christopher Ladewig , Christopher Michael Bryant , Philip Dean Winters
IPC: F21V29/73 , F21S2/00 , F21V29/508 , F21V29/71 , F21V29/76 , F21V29/83 , F21V29/503 , F21S8/08 , F21V15/01 , F21Y103/10 , F21S8/02 , F21Y105/10 , F21Y113/00 , F21W111/02 , F21W111/023 , F21W131/103 , F21Y101/00 , F21Y115/10
CPC classification number: F21V29/73 , F21S2/00 , F21S2/005 , F21S8/026 , F21S8/085 , F21S8/086 , F21V15/013 , F21V29/503 , F21V29/508 , F21V29/713 , F21V29/763 , F21V29/83 , F21W2111/02 , F21W2111/023 , F21W2131/103 , F21Y2101/00 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , Y10T29/49002
Abstract: A modular lighting system may include a support structure, a plurality of heat sink modules physically supported by the support structure, and one or more light source modules coupled to the plurality of heat sink modules. The plurality of heat sink modules may be arranged in a modular manner such that the number of heat sink modules in the modular lighting system is variable, and each heat sink module may be an integral molded structure defining at least one opening or passageway.
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公开(公告)号：US09869462B2
公开(公告)日：2018-01-16
申请号：US15349547
申请日：2016-11-11
Applicant: Cooper Technologies Company
Inventor： Christopher Ladewig , Christopher Michael Bryant , Philip Dean Winters
IPC: F21V7/20 , F21V29/73 , F21S2/00 , F21V15/01 , F21V29/71 , F21V29/76 , F21V29/83 , F21V29/503 , F21V29/508 , F21S8/02 , F21S8/08 , F21W111/02 , F21W111/023 , F21W131/103 , F21Y113/00 , F21Y101/00 , F21Y105/10 , F21Y115/10 , F21Y103/10
CPC classification number: F21V29/73 , F21S2/00 , F21S2/005 , F21S8/026 , F21S8/085 , F21S8/086 , F21V15/013 , F21V29/503 , F21V29/508 , F21V29/713 , F21V29/763 , F21V29/83 , F21W2111/02 , F21W2111/023 , F21W2131/103 , F21Y2101/00 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , Y10T29/49002
Abstract: A modular lighting system may include a support structure, a plurality of heat sink modules physically supported by the support structure, and one or more light source modules coupled to the plurality of heat sink modules. The plurality of heat sink modules may be arranged in a modular manner such that the number of heat sink modules in the modular lighting system is variable, and each heat sink module may be an integral molded structure defining at least one opening or passageway.
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公开(公告)号：US09587814B2
公开(公告)日：2017-03-07
申请号：US15192155
申请日：2016-06-24
Applicant: Cooper Technologies Company
Inventor： Anthony James Carney , Chun Wah Chan , Gregg Arthur Lehman , Ellis Patrick , Christopher Ladewig , Timothy Glen Wright , Christopher Michael Bryant , Victor Diegues
CPC classification number: F21V23/023 , F21K9/20 , F21K9/60 , F21K9/90 , F21S8/03 , F21V5/007 , F21V17/101 , F21V17/12 , F21V19/003 , F21V23/002 , F21V29/76 , F21V29/763 , F21V31/005 , F21Y2105/10 , F21Y2113/00 , F21Y2113/13 , F21Y2115/10 , H05K1/0287 , H05K2201/10106
Abstract: A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over-optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.
Abstract translation: 本文描述了具有能够接收不同数量和LED布局的可配置LED基板的发光二极管（LED）模块。 LED基板包括用于接收LED的LED耦合点和蚀刻到基板中的电迹线以将功率路由到LED。 LED模块可以包括具有多个超光学器件的多LED过光学器件，其被配置为匹配位于衬底上的LED的数量和配置。 可以对称地布置LED耦合点和过光学元件，以使LED模块能够旋转以调节光输出分布和方向。 LED模块可以包括例如位于基板中心的电力连接机构，其也允许LED模块旋转。 一个或多个LED模块可以安装在散热器上并且并入到灯具中。
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公开(公告)号：US20160305638A1
公开(公告)日：2016-10-20
申请号：US15192155
申请日：2016-06-24
Applicant: Cooper Technologies Company
Inventor： Anthony James Carney , Chun Wah Chan , Gregg Arthur Lehman , Ellis Patrick , Christopher Ladewig , Timothy Glen Wright , Christopher Michael Bryant , Victor Diegues
CPC classification number: F21V23/023 , F21K9/20 , F21K9/60 , F21K9/90 , F21S8/03 , F21V5/007 , F21V17/101 , F21V17/12 , F21V19/003 , F21V23/002 , F21V29/76 , F21V29/763 , F21V31/005 , F21Y2105/10 , F21Y2113/00 , F21Y2113/13 , F21Y2115/10 , H05K1/0287 , H05K2201/10106
Abstract: A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over-optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.
Abstract translation: 本文描述了具有能够接收不同数量和LED布局的可配置LED基板的发光二极管（LED）模块。 LED基板包括用于接收LED的LED耦合点和蚀刻到基板中的电迹线以将功率路由到LED。 LED模块可以包括具有多个超光学器件的多LED超光学器件，其被配置为匹配位于衬底上的LED的数量和配置。 可以对称地布置LED耦合点和过光学元件，以使LED模块能够旋转以调节光输出分布和方向。 LED模块可以包括例如位于基板中心的电力连接机构，其也允许LED模块旋转。 一个或多个LED模块可以安装在散热器上并且并入到灯具中。
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公开(公告)号：US20160186980A1
公开(公告)日：2016-06-30
申请号：US14967146
申请日：2015-12-11
Applicant: Cooper Technologies Company
Inventor： Christopher Ladewig , Christopher Michael Bryant , Philip Dean Winters
IPC: F21V29/73 , F21V29/508 , F21V29/83 , F21V29/503
CPC classification number: F21V29/73 , F21S2/00 , F21S2/005 , F21S8/026 , F21S8/085 , F21S8/086 , F21V15/013 , F21V29/503 , F21V29/508 , F21V29/713 , F21V29/763 , F21V29/83 , F21W2111/02 , F21W2111/023 , F21W2131/103 , F21Y2101/00 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , Y10T29/49002
Abstract: A modular lighting system may include a support structure, a plurality of heat sink modules physically supported by the support structure, and one or more light source modules coupled to the plurality of heat sink modules. The plurality of heat sink modules may be arranged in a modular manner such that the heat sink modules in the modular lighting system is variable, and each heat sink module may be an integral molded structure defining at least one opening or passageway.
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