公开(公告)号：US20220339751A1

公开(公告)日：2022-10-27

申请号：US17621049

申请日：2020-06-11

申请人： CORNING INCORPORATED

发明人： Jonas Bankaitis ,  Duc Anh Bui ,  Scott Steven Cronk ,  Christopher Paul Daigler ,  Christina Marie Laskowski ,  Neil Eugene Partridge ,  Uwe Stute ,  Sergio Tsuda ,  Chad Michael Wilcox

IPC分类号： B24B9/10

摘要： Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.

公开(公告)号：US20190382300A1

公开(公告)日：2019-12-19

申请号：US16443020

申请日：2019-06-17

申请人： Corning Incorporated

发明人： Duc Anh Bui ,  Xinghua Li ,  Ralf Joachim Terbrueggen

IPC分类号： C03B33/02 ,  B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K26/359

摘要： A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

公开(公告)号：US11629088B2

公开(公告)日：2023-04-18

申请号：US16443020

申请日：2019-06-17

申请人： Corning Incorporated

发明人： Duc Anh Bui ,  Xinghua Li ,  Ralf Joachim Terbrueggen

IPC分类号： C03B33/02 ,  B23K26/00 ,  B23K26/359 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K103/00

摘要： A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

公开(公告)号：US20190062196A1

公开(公告)日：2019-02-28

申请号：US16111766

申请日：2018-08-24

申请人： CORNING INCORPORATED

发明人： Duc Anh Bui

IPC分类号： C03B33/09 ,  B23K26/364 ,  B23K26/06

摘要： A method for laser processing a transparent workpiece includes forming a contour line in the transparent workpiece and directing an infrared laser beam output by an infrared beam source through an a focal beam adjustment assembly and onto the transparent workpiece along the contour line to separate the transparent workpiece along the contour line. The infrared laser beam forms an annular infrared beam spot on a surface of the transparent workpiece. The infrared laser beam includes an entrance beam diameter upstream the afocal beam adjustment assembly and an exit beam diameter downstream the afocal beam adjustment assembly. The annular infrared beam spot includes an inner diameter, an outer diameter, and an annular thickness. Further, the focal beam adjustment assembly includes one or more adjustable optical elements. Moreover, adjusting the one or more adjustable optical elements alters the exit beam diameter, thereby altering the annular thickness of the annular infrared beam spot.