公开(公告)号：US20230238190A1

公开(公告)日：2023-07-27

申请号：US18129855

申请日：2023-04-01

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: H01G13/00 ,  B05C3/09 ,  B05C13/02

CPC classification number: H01G13/006 ,  B05C3/09 ,  B05C13/025 ,  H01G4/228

Abstract: A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1

公开(公告)号：US20220282368A1

公开(公告)日：2022-09-08

申请号：US17688786

申请日：2022-03-07

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/448 ,  C23C16/44 ,  C23C16/455

Abstract: A method for forming a barium titanate film by conducting an ALD cycle, wherein the ALD cycle comprises forming a titanium oxide film and forming barium oxide film. In the forming of a titanium oxide film, TDMAT (Ti[N(CH3)2]4) is used as first raw material gas, and an OH radical is used as reaction gas, and in the forming of barium oxide film, a vaporized barium complex is used as second raw material gas, and an OH radical is used as reaction gas, and the titanium oxide film and the barium oxide film are alternately formed in a normal order or a reverse order.

公开(公告)号：US20220259732A1

公开(公告)日：2022-08-18

申请号：US17735897

申请日：2022-05-03

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/52

Abstract: A film formation method for forming a CVD film and an ALD film on a film formation target. In an ALD process, an ALD cycle is repeatedly executed a plurality of times, the ALD cycle including: a first step for filling a reaction container with a source gas introduced through a first supply pipe; a second step for exhausting the source gas from the reaction container; a third step for filling the reaction container with a reactant gas activated by an inductively coupled plasma in a second supply pipe and introduced through the second supply pipe; and a fourth step for exhausting the reactant gas from the reaction container. In a CVD process, the ALD cycle is executed at least once, and the second step is finished while leaving the source gas in a gas phase in the reaction container.

公开(公告)号：US20210308717A1

公开(公告)日：2021-10-07

申请号：US17348682

申请日：2021-06-15

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B05D1/18 ,  H01G13/00 ,  H01C17/28 ,  H05K1/18 ,  B05C3/09 ,  B05C13/02 ,  H01G2/06 ,  H01G4/005

Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

公开(公告)号：US20230060617A1

公开(公告)日：2023-03-02

申请号：US17897170

申请日：2022-08-28

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/44

Abstract: A film forming apparatus configured to form a metal oxide film or a metal nitride film through atomic layer deposition by alternately introducing metal compound gas and an OH radical or an NH radical in a reaction container. The film forming apparatus including: the reaction container; and at least one plasma generator provided outside the reaction container and configured to generate a first plasma including an oxygen radical or a nitrogen radical when oxygen or nitrogen is supplied and generate a second plasma including a hydrogen radical when hydrogen is supplied. The OH radical is generated by collision between the oxygen radical and the hydrogen radical or the NH radical is generated by collision between the nitrogen radical and the hydrogen radical in a downstream region from an outlet of the at least one plasma generator to an inner space of the reaction container.

公开(公告)号：US20230012995A1

公开(公告)日：2023-01-19

申请号：US17954285

申请日：2022-09-27

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B05C11/02 ,  B05C3/09 ,  B05D1/18 ,  H01G13/00 ,  H01G4/30

Abstract: A pre-press process includes a first step for bonding a first end portion of each of a plurality of electronic component bodies to a bonding surface of a flat plate material disposed in a jig, a second step for moving the jig relative to a surface plate, a third step for bringing a second end portions of each of the plurality of electronic component bodies into contact with the surface plate while the flat plate material is in a softened state so that the flat plate material is deformed to align respective positions of end surfaces of the second end portions, a fourth step for curing the flat plate material, and then a fifth step for moving the jig relative to the surface plate to separate from the surface plate the plurality of electronic component bodies in which the respective positions of the end surfaces are aligned.

公开(公告)号：US20210285106A1

公开(公告)日：2021-09-16

申请号：US17216532

申请日：2021-03-29

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/54 ,  C23C16/455

Abstract: A film deposition apparatus includes: a chamber having a film deposition gas introduced thereinto and exhausted therefrom, in which film deposition with the film deposition gas is performed on an object to be treated; and a film conveying part disposed in the chamber and conveying in a roll-to-roll manner a long film that is the object to be treated. The film conveying part includes: a rotatable roller with part of whose peripheral surface the long film comes into contact; and a nozzle pipe for spraying an inert gas onto a region of the roller, the region being not covered by the long film.

公开(公告)号：US20210339963A1

公开(公告)日：2021-11-04

申请号：US17372073

申请日：2021-07-09

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: B65G47/52 ,  B05D7/00 ,  B05D3/06 ,  B05D3/12 ,  B65G49/06 ,  B05C13/02

Abstract: A paste coating apparatus includes a first feeder that feeds a first belt, a mounter that joins one end portion of each of a plurality of electronic components to the first belt, a first coater that coats paste on the other end portion of each of the plurality of electronic components mounted on the first belt, a first dryer that dries the paste, a second feeder that feeds a second belt, a transfer device that transfers the plurality of electronic components from the first belt to the second belt, a second coater that coats the paste on the one end portion of each of the plurality of electronic components mounted on the second belt, a second dryer that dries the paste, and a collection device that winds and collects the second belt.

公开(公告)号：US20240038455A1

公开(公告)日：2024-02-01

申请号：US18380168

申请日：2023-10-14

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: H01G13/00 ,  H01G4/30

CPC classification number: H01G13/006 ,  H01G4/30

Abstract: An intaglio jig for manufacturing an electronic component having an external electrode by applying a conductive paste to an electronic component body includes an elastic body, and a recessed portion that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening having an opening width that conforms to a width of the external electrode, a bottom surface at a predetermined depth from the opening, and at least one protrusion portion in which a protrusion height locally protruding from the bottom surface is less than the predetermined depth.

公开(公告)号：US20230124553A1

公开(公告)日：2023-04-20

申请号：US17963858

申请日：2022-10-11

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji SATO ,  Hitoshi SAKAMOTO

IPC: C23C16/44 ,  C23C16/50 ,  C23C16/455

Abstract: A method for forming films on particles of powder includes diffusing the powder by leading the powder into a jet nozzle and ejecting a jet flow of the powder; leading the diffused particles of powder, a raw material gas, and a reaction gas activated by atmospheric pressure plasma, into a reaction container, and forming a swirl flow in the container; and forming the films on the diffused particles of powder by reaction of a raw material gas and an activated reaction gas in the container. An apparatus is also disclosed having a reaction container with a peripheral wall having a round section in plan view and a jet nozzle for a powder source, raw material gas, and atmospheric pressure plasma sources are coupled to and enter the container at an angle with a radius thereof thereby forming a swirl flow to form a film on the powder.