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公开(公告)号:US20210375798A1
公开(公告)日:2021-12-02
申请号:US17194390
申请日:2021-03-08
Applicant: Credo Technology Group Limited
Inventor: Mengying MA , Xike LIU , Xiangxiang YE , Xin WANG
IPC: H01L23/66 , H03H11/28 , H03M9/00 , H01L23/00 , H01L23/498
Abstract: An illustrative embodiment of a packaged integrated circuit includes: an integrated circuit chip having a SerDes signal pad; and a package substrate having a core via and an arrangement of micro-vias connecting the SerDes signal pad to an external contact for solder ball connection to a PCB trace. The core via has a first parasitic capacitance, the solder ball connection is associated with a second parasitic capacitance, and the arrangement of micro-vias provides a pi-network inductance that improves connection impedance matching. An illustrative method embodiment includes: obtaining an expected impedance of the PCB trace; determining parasitic capacitances of a core via and a solder ball connection to the PCB trace; minimizing the core via capacitance; calculating a pi-network inductance that improves impedance matching with the PCB trace; and adjusting a micro-via arrangement between the core via and the solder ball connection to provide the pi-network inductance.
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公开(公告)号:US20210280996A1
公开(公告)日:2021-09-09
申请号:US17146350
申请日:2021-01-11
Applicant: Credo Technology Group Limited
Inventor: Xike LIU , Zhining LI , Xiangxiang YE , Gaige MEI
Abstract: Connector paddle cards are provided with an improved wiring connection geometry that reduces impedance mismatch. One illustrative embodiment is a printed circuit board having, on at least one surface: edge connector traces arranged along a first edge for contacting electrical conductors in a socket connector; an outer set of electrodes arranged parallel to a second edge for attaching exposed ends of sheathed wires in a cable (“outer wires”); and an inner set of electrodes arranged parallel to the second edge for attaching exposed ends of sheathed wires in a cable (“inner wires”), with the electrodes in the inner set being staggered relative to the electrodes in the outer set.
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