公开(公告)号：US20170363795A1

公开(公告)日：2017-12-21

申请号：US15186222

申请日：2016-06-17

Applicant: Cree, Inc.

Inventor： Claudio GIROTTO ,  Theodore LOWES ,  Chandan BHAT ,  Mark YOUMANS

IPC: F21V8/00

Abstract: In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.