公开(公告)号：US20190116297A1

公开(公告)日：2019-04-18

申请号：US15784931

申请日：2017-10-16

Applicant: Cree, Inc.

Inventor： Mark YOUMANS ,  Hormoz BENJAMIN ,  Theodore LOWES

IPC: H04N5/225 ,  F21V29/70 ,  F21V33/00

Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

公开(公告)号：US20170363795A1

公开(公告)日：2017-12-21

申请号：US15186222

申请日：2016-06-17

Applicant: Cree, Inc.

Inventor： Claudio GIROTTO ,  Theodore LOWES ,  Chandan BHAT ,  Mark YOUMANS

IPC: F21V8/00

Abstract: In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.