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    SENSOR HOUSINGS, MODULES, AND LUMINAIRES INCORPORATING THE SAME
    1.
    发明申请
    SENSOR HOUSINGS, MODULES, AND LUMINAIRES INCORPORATING THE SAME 审中-公开

    公开(公告)号：US20190116297A1

    公开(公告)日：2019-04-18

    申请号：US15784931

    申请日：2017-10-16

    Applicant: Cree, Inc.

    Inventor： Mark YOUMANS ,  Hormoz BENJAMIN ,  Theodore LOWES

    IPC: H04N5/225 ,  F21V29/70 ,  F21V33/00

    Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

    MULTI-LAYER CONVERSION MATERIAL FOR DOWN CONVERSION IN SOLID STATE LIGHTING
    2.
    发明申请
    MULTI-LAYER CONVERSION MATERIAL FOR DOWN CONVERSION IN SOLID STATE LIGHTING 有权

    公开(公告)号：US20210366880A9

    公开(公告)日：2021-11-25

    申请号：US14453482

    申请日：2014-08-06

    Applicant: CREE, INC.

    Inventor： FAN ZHANG ,  James IBBETSON ,  Bernd KELLER ,  Theodore LOWES ,  Antony VAN DE VEN ,  Deborah KIRCHER ,  Tao Feng GILBERT ,  Peter Andrews

    IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60

    Abstract: Light emitting diodes are disclosed that utilize multiple conversion materials in the conversion process in order to achieve the desired emission color point. Different embodiments of the present invention can comprise different phosphor types in separate layers on, above or around one or a plurality of LED chips to achieve the desired light conversion. The LEDs can then emit a desired combination of light from the LED chips and conversion material. In some embodiments, conversion materials can be applied as layers of different phosphor types in order of longest emission wavelength phosphor first, followed by shorter emission phosphors in sequence as opposed to applying in a homogeneously mixed phosphor converter. The conversion material layers can be applied as a blanket over the LED chips and the area surrounding the chip, such as the surface of a submount holding the LED chips.

    BONDED OPTICAL SYSTEMS AND APPLICATIONS THEREOF
    4.
    发明申请
    BONDED OPTICAL SYSTEMS AND APPLICATIONS THEREOF 审中-公开

    公开(公告)号：US20170363795A1

    公开(公告)日：2017-12-21

    申请号：US15186222

    申请日：2016-06-17

    Applicant: Cree, Inc.

    Inventor： Claudio GIROTTO ,  Theodore LOWES ,  Chandan BHAT ,  Mark YOUMANS

    IPC: F21V8/00

    Abstract: In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.

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