公开(公告)号：US20200035660A1

公开(公告)日：2020-01-30

申请号：US16589624

申请日：2019-10-01

Applicant: Cree, Inc.

Inventor： Saurabh Goel ,  Alexander Komposch ,  Cynthia Blair ,  Cristian Gozzi

IPC: H01L25/00 ,  H01L23/36 ,  H01L23/538 ,  H01L23/66

Abstract: A multi-cavity package includes a single metal flange having first and second opposing main surfaces. The multi-cavity package also includes a circuit board attached to the first main surface of the single metal flange. The circuit board includes a first surface facing the single metal flange, and a second surface facing away from the first surface. The circuit board also includes a plurality of openings exposing different regions of the first main surface of the single metal flange. The circuit board also includes a lateral extension that overhangs the single metal flange. A corresponding method of manufacturing is also provided.

公开(公告)号：US10468399B2

公开(公告)日：2019-11-05

申请号：US14673928

申请日：2015-03-31

Applicant: Cree, Inc.

Inventor： Saurabh Goel ,  Alexander Komposch ,  Cynthia Blair ,  Cristian Gozzi

IPC: H01L23/495 ,  H01L25/00 ,  H01L23/66 ,  H01L23/538 ,  H01L23/36 ,  H01L25/065

Abstract: A multi-cavity package includes a single metal flange having first and second opposing main surfaces, a circuit board attached to the first main surface of the single metal flange, the circuit board having a plurality of openings which expose different regions of the first main surface of the single metal flange, and a plurality of semiconductor dies each of which is disposed in one of the openings in the circuit board and attached to the first main surface of the single metal flange. The circuit board includes a plurality of metal traces for electrically interconnecting the semiconductor dies to form a circuit. A corresponding method of manufacturing is also provided.