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公开(公告)号：US20190116297A1
公开(公告)日：2019-04-18
申请号：US15784931
申请日：2017-10-16
Applicant: Cree, Inc.
Inventor： Mark YOUMANS , Hormoz BENJAMIN , Theodore LOWES
Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.
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