公开(公告)号：US20210198804A1

公开(公告)日：2021-07-01

申请号：US17124810

申请日：2020-12-17

Applicant: Cree, Inc.

Inventor： Yuri Khlebnikov ,  Varad R. Sakhalkar ,  Caleb A. Kent ,  Valeri F. Tsvetkov ,  Michael J. Paisley ,  Oleksandr Kramarenko ,  Matthew David Conrad ,  Eugene Deyneka ,  Steven Griffiths ,  Simon Bubel ,  Adrian R. Powell ,  Robert Tyler Leonard ,  Elif Balkas ,  Jeffrey C. Seaman

IPC: C30B29/36 ,  H01L29/16 ,  H01L29/34 ,  H01L29/36 ,  H01L21/04 ,  C30B23/02 ,  C30B31/22 ,  C30B33/02

Abstract: Silicon carbide (SiC) wafers and related methods are disclosed that include large diameter SiC wafers with wafer shape characteristics suitable for semiconductor manufacturing. Large diameter SiC wafers are disclosed that have reduced deformation related to stress and strain effects associated with forming such SiC wafers. As described herein, wafer shape and flatness characteristics may be improved by reducing crystallographic stress profiles during growth of SiC crystal boules or ingots. Wafer shape and flatness characteristics may also be improved after individual SiC wafers have been separated from corresponding SiC crystal boules. In this regard, SiC wafers and related methods are disclosed that include large diameter SiC wafers with suitable crystal quality and wafer shape characteristics including low values for wafer bow, warp, and thickness variation.