公开(公告)号：US20220360230A1

公开(公告)日：2022-11-10

申请号：US17313567

申请日：2021-05-06

Applicant: Cree, Inc.

Inventor： Marvin Marbell ,  Jonathan Chang ,  Haedong Jang ,  Qianli Mu ,  Michael LeFevre ,  Jeremy Fisher ,  Basim Noori

IPC: H03F1/02 ,  H03F1/56 ,  H01L23/66 ,  H01L23/498

Abstract: A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.

公开(公告)号：US20220360233A1

公开(公告)日：2022-11-10

申请号：US17313616

申请日：2021-05-06

Applicant: Cree, Inc.

Inventor： Marvin Marbell ,  Jonathan Chang

IPC: H03F1/56 ,  H01L23/047 ,  H01L23/66 ,  H03F1/02 ,  H03F3/21

Abstract: A semiconductor device package includes a plurality of input leads, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combined output lead configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal.