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1.发明申请公开(公告)号：US20210351121A1
公开(公告)日：2021-11-11
申请号：US17085433
申请日：2020-10-30
Applicant: Cree, Inc.
Inventor： Mitch Flowers , Erwin Cohen , Alexander Komposch , Larry Christopher Wall
IPC: H01L23/528
Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.
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