公开(公告)号：US20210351113A1

公开(公告)日：2021-11-11

申请号：US16868639

申请日：2020-05-07

Applicant: Cree, Inc.

Inventor： Mitch Flowers ,  Erwin Cohen ,  Alexander Komposch

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

公开(公告)号：US20200321268A1

公开(公告)日：2020-10-08

申请号：US16909334

申请日：2020-06-23

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/34 ,  H01L23/60

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

公开(公告)号：US11424177B2

公开(公告)日：2022-08-23

申请号：US16868639

申请日：2020-05-07

Applicant: Cree, Inc.

Inventor： Mitch Flowers ,  Erwin Cohen ,  Alexander Komposch

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

公开(公告)号：US10720379B2

公开(公告)日：2020-07-21

申请号：US16226517

申请日：2018-12-19

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/22 ,  H01L23/495 ,  H01L23/34 ,  H01L23/31 ,  H01L23/60

Abstract: The base of an integrated circuit package comprises a first side, and a second side opposing the first side. The base further comprises, a base mounting section, a die mounting section, and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises an opening extending through the base from the first side to the second side. At least a portion of the recess intersects with the opening.

公开(公告)号：US20210351121A1

公开(公告)日：2021-11-11

申请号：US17085433

申请日：2020-10-30

Applicant: Cree, Inc.

Inventor： Mitch Flowers ,  Erwin Cohen ,  Alexander Komposch ,  Larry Christopher Wall

IPC: H01L23/528

Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

公开(公告)号：US10886198B2

公开(公告)日：2021-01-05

申请号：US16909334

申请日：2020-06-23

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/495 ,  H01L23/60 ,  H01L23/34 ,  H01L23/31

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.