公开(公告)号：US10260685B2

公开(公告)日：2019-04-16

申请号：US15427568

申请日：2017-02-08

Applicant: Cree, Inc.

Inventor： Randall Levy Bernard ,  P. Joseph DeSena, Jr. ,  Philip Scott

IPC: F21V29/77 ,  A61L9/02 ,  F21V17/10 ,  F21K9/237 ,  F21K9/235 ,  F21V29/83 ,  F21K9/232 ,  F21V23/00 ,  F21V29/85 ,  F21V33/00 ,  F21Y115/10

Abstract: An LED lamp includes a LED assembly comprising at least one LED operable to emit light when energized through an electrical path. A heat sink structure is thermally coupled to the LED assembly for dissipating heat to the ambient environment. An aromatic structure is thermally coupled to the heat sink structure such that the aromatic structure is heated by the heat dissipated from the heat sink.

公开(公告)号：US20180224072A1

公开(公告)日：2018-08-09

申请号：US15427568

申请日：2017-02-08

Applicant: Cree, Inc.

Inventor： Randall Levy Bernard ,  P. Joseph DeSena, JR. ,  Philip Scott

IPC: F21K9/237 ,  F21K9/235 ,  F21V29/83 ,  F21V3/02 ,  F21K9/232 ,  F21V29/77 ,  F21K9/238 ,  F21S8/02 ,  F21V23/00 ,  F21V17/10

CPC classification number: F21K9/237 ,  A61L9/02 ,  F21K9/232 ,  F21K9/235 ,  F21V17/10 ,  F21V23/005 ,  F21V29/77 ,  F21V29/83 ,  F21V29/85 ,  F21V33/0024 ,  F21Y2115/10

Abstract: An LED lamp includes a LED assembly comprising at least one LED operable to emit light when energized through an electrical path. A heat sink structure is thermally coupled to the LED assembly for dissipating heat to the ambient environment. An aromatic structure is thermally coupled to the heat sink structure such that the aromatic structure is heated by the heat dissipated from the heat sink.