公开(公告)号：US20180225834A1

公开(公告)日：2018-08-09

申请号：US15887096

申请日：2018-02-02

Applicant: Cree, Inc.

Inventor： Sten Heikman ,  Yuvaraj Dora ,  Ronald W. Bessems ,  John Roberts ,  Robert D. Underwood

IPC: G06T7/246

CPC classification number: G06T7/248 ,  G06K9/00771 ,  G06K9/2036 ,  G06K9/4628 ,  G06K9/6274 ,  G06T7/254 ,  G06T2207/20021 ,  H05B37/0227

Abstract: A method includes the steps of obtaining a frame from an image sensor, the frame comprising a number of pixel values, detecting a change in a first subset of the pixel values, detecting a change in the second subset of the pixel values near the first subset of the pixel values, and determining an occupancy state based on a relationship between the change in the first subset of the pixel values and the second subset of the pixel values. The occupancy state may be determined to be occupied when the change in the first subset of the pixel values is in a first direction and the change in the second subset of the pixel values is in a second direction opposite the first direction.

公开(公告)号：US10658546B2

公开(公告)日：2020-05-19

申请号：US14602040

申请日：2015-01-21

Applicant: CREE, INC.

Inventor： Matthew Donofrio ,  Pritish Kar ,  Sten Heikman ,  Harshad Golakia ,  Rajeev Acharya ,  Yuvaraj Dora

IPC: H01L33/46 ,  H01L33/14 ,  H01L33/38 ,  H01L33/00 ,  H01L33/42

Abstract: Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.