PARTICLE EMISSION ANALYSIS FOR SEMICONDUCTOR FABRICATION STEPS
    1.
    发明申请
    PARTICLE EMISSION ANALYSIS FOR SEMICONDUCTOR FABRICATION STEPS 有权
    用于半导体制造步骤的颗粒排放分析

    公开(公告)号:US20100084656A1

    公开(公告)日:2010-04-08

    申请号:US12247474

    申请日:2008-10-08

    IPC分类号: H01L23/58 H01L21/66

    CPC分类号: G01T1/00 H01L22/10

    摘要: A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously performed on the detecting structure and M product structures in a fabrication tool resulting in a particle-emitting layer on the detecting structure. The detecting structure is different than the M product structures. The M product structures are identical. M is a positive integer. An impact of emitting particles from the particle-emitting layer on the detecting structure is analyzed after said performing is performed.

    摘要翻译: 一种结构及其操作方法。 该方法包括提供包括N个检测器的检测结构。 N是正整数。 在制造工具中的检测结构和M产品结构上同时进行制造步骤,从而在检测结构上产生颗粒发射层。 检测结构与M产品结构不同。 M产品结构相同。 M是正整数。 在执行所述执行之后,分析从颗粒发射层发射颗粒对检测结构的影响。

    Particle emission analysis for semiconductor fabrication steps
    2.
    发明授权
    Particle emission analysis for semiconductor fabrication steps 有权
    半导体制造步骤的粒子发射分析

    公开(公告)号:US08158449B2

    公开(公告)日:2012-04-17

    申请号:US12247474

    申请日:2008-10-08

    IPC分类号: H01L21/00

    CPC分类号: G01T1/00 H01L22/10

    摘要: A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously performed on the detecting structure and M product structures in a fabrication tool resulting in a particle-emitting layer on the detecting structure. The detecting structure is different than the M product structures. The M product structures are identical. M is a positive integer. An impact of emitting particles from the particle-emitting layer on the detecting structure is analyzed after said performing is performed.

    摘要翻译: 一种结构及其操作方法。 该方法包括提供包括N个检测器的检测结构。 N是正整数。 在制造工具中的检测结构和M产品结构上同时进行制造步骤,从而在检测结构上产生颗粒发射层。 检测结构与M产品结构不同。 M产品结构相同。 M是正整数。 在执行所述执行之后,分析从颗粒发射层发射颗粒对检测结构的影响。