PARTICLE EMISSION ANALYSIS FOR SEMICONDUCTOR FABRICATION STEPS
    1.
    发明申请
    PARTICLE EMISSION ANALYSIS FOR SEMICONDUCTOR FABRICATION STEPS 有权
    用于半导体制造步骤的颗粒排放分析

    公开(公告)号:US20100084656A1

    公开(公告)日:2010-04-08

    申请号:US12247474

    申请日:2008-10-08

    IPC分类号: H01L23/58 H01L21/66

    CPC分类号: G01T1/00 H01L22/10

    摘要: A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously performed on the detecting structure and M product structures in a fabrication tool resulting in a particle-emitting layer on the detecting structure. The detecting structure is different than the M product structures. The M product structures are identical. M is a positive integer. An impact of emitting particles from the particle-emitting layer on the detecting structure is analyzed after said performing is performed.

    摘要翻译: 一种结构及其操作方法。 该方法包括提供包括N个检测器的检测结构。 N是正整数。 在制造工具中的检测结构和M产品结构上同时进行制造步骤,从而在检测结构上产生颗粒发射层。 检测结构与M产品结构不同。 M产品结构相同。 M是正整数。 在执行所述执行之后,分析从颗粒发射层发射颗粒对检测结构的影响。

    Method for fabricating different gate oxide thicknesses within the same chip
    2.
    发明授权
    Method for fabricating different gate oxide thicknesses within the same chip 失效
    在同一芯片内制造不同栅极氧化物厚度的方法

    公开(公告)号:US06335262B1

    公开(公告)日:2002-01-01

    申请号:US09231617

    申请日:1999-01-14

    IPC分类号: H01L2131

    摘要: A semiconductor structure having silicon dioxide layers of different thicknesses is fabricated by forming a sacrificial silicon dioxide layer on the surface of a substrate; implanting nitrogen ions through the sacrificial silicon dioxide layer into first areas of the semiconductor substrate; implanting chlorine and/or bromine ions through the sacrificial silicon dioxide layer into second areas of the semiconductor substrate where silicon dioxide having the highest thickness is to be formed; removing the sacrificial silicon dioxide layer; and then growing a layer of silicon dioxide on the surface of the semiconductor substrate. The growth rate of the silicon dioxide will be faster in the areas containing the chlorine and/or bromine ions and therefore the silicon dioxide layer will be thicker in those regions as compared to the silicon dioxide layer in the regions not containing the chlorine and/or bromine ions. The growth rate of the silicon dioxide will be slower in the areas containing the nitrogen ions and therefore the silicon dioxide layer will be thinner in those regions as compared to the silicon dioxide layer in the regions not containing the nitrogen ions. Also provided are structures obtained by the above process.

    摘要翻译: 通过在基板的表面上形成牺牲二氧化硅层来制造具有不同厚度的二氧化硅层的半导体结构; 将氮离子通过牺牲二氧化硅层注入到半导体衬底的第一区域中; 将氯和/或溴离子通过牺牲二氧化硅层注入到要形成具有最高厚度的二氧化硅的半导体衬底的第二区域中; 去除牺牲二氧化硅层; 然后在半导体衬底的表面上生长一层二氧化硅。 在含有氯和/或溴离子的区域中,二氧化硅的生长速度将更快,因此与不含氯和/或溴离子的区域中的二氧化硅层相比,二氧化硅层在这些区域中将更厚。 溴离子。 与含氮离子的区域相比,在含氮离子的区域中,二氧化硅的生长速度较慢,因此与这些区域的二氧化硅层相比,二氧化硅层较薄。 还提供了通过上述方法获得的结构。

    Particle emission analysis for semiconductor fabrication steps
    4.
    发明授权
    Particle emission analysis for semiconductor fabrication steps 有权
    半导体制造步骤的粒子发射分析

    公开(公告)号:US08158449B2

    公开(公告)日:2012-04-17

    申请号:US12247474

    申请日:2008-10-08

    IPC分类号: H01L21/00

    CPC分类号: G01T1/00 H01L22/10

    摘要: A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously performed on the detecting structure and M product structures in a fabrication tool resulting in a particle-emitting layer on the detecting structure. The detecting structure is different than the M product structures. The M product structures are identical. M is a positive integer. An impact of emitting particles from the particle-emitting layer on the detecting structure is analyzed after said performing is performed.

    摘要翻译: 一种结构及其操作方法。 该方法包括提供包括N个检测器的检测结构。 N是正整数。 在制造工具中的检测结构和M产品结构上同时进行制造步骤,从而在检测结构上产生颗粒发射层。 检测结构与M产品结构不同。 M产品结构相同。 M是正整数。 在执行所述执行之后,分析从颗粒发射层发射颗粒对检测结构的影响。