公开(公告)号：US20160214328A1

公开(公告)日：2016-07-28

申请号：US15082245

申请日：2016-03-28

Applicant: Cytec Industries Inc.

Inventor： Leonard A. MacAdams ,  Dalip K. Kohli

IPC: B29C70/30 ,  B29C65/48 ,  B29C65/00

CPC classification number: B29C70/30 ,  B29C65/14 ,  B29C65/1406 ,  B29C65/4835 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/73161 ,  B29C66/73754 ,  B29C66/73941 ,  B29L2031/3055 ,  B29L2031/3076 ,  C09J5/02 ,  C09J2400/263 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2479/08 ,  F16B11/006 ,  B29K2307/04 ,  B29K2277/10 ,  B29K2063/00 ,  B29K2061/04 ,  B29K2067/06 ,  B29K2079/08

Abstract: A composite bonding process is disclosed. At least one of two curable, resin-based composite substrates is partially cured to a degree of cure of at least 10% but less than 75% of full cure. The composite substrates are then joined to each other with a curable adhesive there between. Co-curing of the joined substrates is carried out to form a bonded composite structure, whereby the adhesive is chemically bonded to and mechanically diffused with the resin matrix of the composite substrates, resulting in a chemically bonded interface between the adhesive and each composite substrate. Furthermore, bonding can occur with the presence of contaminants on the joined surfaces.

Abstract translation: 公开了复合粘结工艺。 两种可固化的树脂基复合基材中的至少一种部分固化至至少10％但小于完全固化的75％的固化程度。 然后，复合基板之间用可固化粘合剂彼此连接。 进行接合的基板的共固化以形成粘合复合结构，由此粘合剂与复合基板的树脂基体化学键合并机械扩散，从而在粘合剂和每个复合基材之间形成化学键合的界面。 此外，可以在接合表面上存在污染物的情况下发生粘合。

公开(公告)号：US20140144568A1

公开(公告)日：2014-05-29

申请号：US14083928

申请日：2013-11-19

Applicant: Cytec Industries Inc.

Inventor： Leonard A. MacAdams ,  Dalip K. KOHLI

IPC: B32B37/02

CPC classification number: B29C70/30 ,  B29C65/14 ,  B29C65/1406 ,  B29C65/4835 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/73161 ,  B29C66/73754 ,  B29C66/73941 ,  B29L2031/3055 ,  B29L2031/3076 ,  C09J5/02 ,  C09J2400/263 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2479/08 ,  F16B11/006 ,  B29K2307/04 ,  B29K2277/10 ,  B29K2063/00 ,  B29K2061/04 ,  B29K2067/06 ,  B29K2079/08

Abstract: A composite bonding process is disclosed. At least one of two curable, resin-based composite substrates is partially cured to a degree of cure of at least 10% but less than 75% of full cure. The composite substrates are then joined to each other with a curable adhesive there between. Co-curing of the joined substrates is carried out to form a bonded composite structure, whereby the adhesive is chemically bonded to and mechanically diffused with the resin matrix of the composite substrates, resulting in a chemically bonded interface between the adhesive and each composite substrate. Furthermore, bonding can occur with the presence of contaminants on the joined surfaces.

Abstract translation: 公开了复合粘结工艺。 两种可固化的树脂基复合基材中的至少一种部分固化至至少10％但小于完全固化的75％的固化程度。 然后，复合基板之间用可固化粘合剂彼此连接。 进行接合的基板的共固化以形成粘合复合结构，由此粘合剂与复合基板的树脂基体化学键合并机械扩散，从而在粘合剂和每个复合基材之间形成化学键合的界面。 此外，可以在接合表面上存在污染物的情况下发生粘合。