公开(公告)号：US11647590B2

公开(公告)日：2023-05-09

申请号：US16896554

申请日：2020-06-09

Applicant: D-WAVE SYSTEMS INC.

Inventor： Jeffrey P. Burress ,  Richard D. Neufeld ,  Surjit Singh Dhesi

IPC: H05K3/06 ,  H01L39/24

CPC classification number: H05K3/067 ,  H01L39/24 ,  H05K3/064

Abstract: A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.