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公开(公告)号：US11678433B2
公开(公告)日：2023-06-13
申请号：US16560517
申请日：2019-09-04
Applicant: D-WAVE SYSTEMS INC.
Inventor： Richard D. Neufeld
IPC: H05K7/06 , B23P19/00 , H05K1/02 , H05K1/09 , H05K1/14 , H05K3/30 , H01R24/50 , H01R25/00 , H01L39/04 , H01R103/00
CPC classification number: H05K1/0243 , H01L39/04 , H01R24/50 , H01R25/006 , H05K1/0266 , H05K1/09 , H05K1/144 , H05K3/301 , H01R2103/00 , H05K2201/09809 , H05K2201/10446 , H05K2203/166
Abstract: Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
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公开(公告)号：US20200084882A1
公开(公告)日：2020-03-12
申请号：US16560517
申请日：2019-09-04
Applicant: D-Wave Systems Inc.
Inventor： Richard D. Neufeld
Abstract: Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
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公开(公告)号：US20200068722A1
公开(公告)日：2020-02-27
申请号：US16465765
申请日：2017-12-07
Applicant: D-Wave Systems Inc.
Inventor： Richard D. Neufeld
Abstract: A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers.
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公开(公告)号：US20240019514A1
公开(公告)日：2024-01-18
申请号：US18104489
申请日：2023-02-01
Applicant: D-WAVE SYSTEMS INC.
Inventor： Richard D. Neufeld , Surjit Singh Dhesi , Oscar Yui-kit Fung
IPC: G01R33/421 , G01R33/035 , H01F6/04
CPC classification number: G01R33/421 , G01R33/0358 , H01F6/04
Abstract: Thermally isolating cable assemblies, systems using the assemblies, and methods for fabricating the assemblies are discussed. A cable assembly includes a first shielding cable comprising a first solderable material interleaved with a section of a second shielding cable comprising an exterior material that is a second solderable material and an inner material that is superconductive at and below a critical temperature. The cable assembly may be fabricated during the assembly of an apparatus, and, following assembly of the apparatus, a segment of the second shielding cable is etched to expose a portion of the inner material. Following fabrication of the cable assemblies, the apparatus may be installed in a cryogenic environment in which the inner material may be operable as a superconductor and may thermally isolate the cabling assembly distal to the exposed portion to reduce heat load to a superconducting circuit.
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5.发明授权公开(公告)号：US10755190B2
公开(公告)日：2020-08-25
申请号：US15382278
申请日：2016-12-16
Applicant: D-Wave Systems Inc.
Inventor： Alexandr M. Tcaciuc , Pedro A. de Buen , Peter D. Spear , Sergey V. Uchaykin , Colin C. Enderud , Richard D. Neufeld , Jeremy P. Hilton , J. Craig Petroff , Amar B. Kamdar , Gregory D. Peregrym , Edmond Ho Yin Kan , Loren J. Swenson , George E. G. Sterling , Gregory Citver
IPC: H01F7/06 , G06N10/00 , H03H3/00 , H01F41/04 , H01F13/00 , H03H7/42 , H05K1/02 , H01F41/076 , H03H1/00 , H05K1/16 , H01L39/14 , H01L39/02
Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
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Patent Agency Ranking
公开(公告)号：US10097151B2
公开(公告)日：2018-10-09
申请号：US15672506
申请日：2017-08-09
Applicant: D-Wave Systems Inc.
Inventor： Murray C. Thom , Alexander M. Tcaciuc , Gordon Lamont , J. Craig Petroff , Richard D. Neufeld , David S. Bruce , Sergey V. Uchaykin
IPC: H03H7/00 , H01P1/20 , H03H1/00 , H01F6/06 , H01F41/04 , H01L39/14 , H01P1/203 , H01L39/02 , H01F27/28 , H03H7/01
Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.
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公开(公告)号：US11647590B2
公开(公告)日：2023-05-09
申请号：US16896554
申请日：2020-06-09
Applicant: D-WAVE SYSTEMS INC.
Inventor： Jeffrey P. Burress , Richard D. Neufeld , Surjit Singh Dhesi
Abstract: A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.
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公开(公告)号：US11617272B2
公开(公告)日：2023-03-28
申请号：US16465765
申请日：2017-12-07
Applicant: D-WAVE SYSTEMS INC.
Inventor： Richard D. Neufeld
Abstract: A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers.
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公开(公告)号：US20170373658A1
公开(公告)日：2017-12-28
申请号：US15672506
申请日：2017-08-09
Applicant: D-Wave Systems Inc.
Inventor： Murray C. Thom , Alexander M. Tcaciuc , Gordon Lamont , J. Craig Petroff , Richard D. Neufeld , David S. Bruce , Sergey V. Uchaykin
CPC classification number: H03H1/00 , H01F6/06 , H01F6/065 , H01F27/2823 , H01F41/048 , H01F41/069 , H01F41/076 , H01L39/02 , H01L39/14 , H01P1/203 , H03H7/0115 , H03H7/0138 , H03H7/1741 , H03H2001/0078
Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.
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公开(公告)号：US20170178018A1
公开(公告)日：2017-06-22
申请号：US15382278
申请日：2016-12-16
Applicant: D-Wave Systems Inc.
Inventor： Alexandr M. Tcaciuc , Pedro A. de Buen , Peter D. Spear , Sergey V. Uchaykin , Colin C. Enderud , Richard D. Neufeld , Jeremy P. Hilton , J. Craig Petroff , Amar B. Kamdar , Gregory D. Peregrym , Edmond Ho Yin Kan , Loren J. Swenson , George E.G. Sterling , Gregory Citver
IPC: G06N99/00 , H01L39/12 , H01L39/24 , H05K3/34 , H05K9/00 , F25B43/00 , H01L39/18 , H01F41/06 , H01F41/04 , H01F13/00 , F25B9/12 , H03H3/00 , H05K1/02
CPC classification number: G06N10/00 , H01F13/006 , H01F41/048 , H01F41/076 , H01L39/02 , H01L39/14 , H03H3/00 , H03H7/425 , H03H2001/005 , H05K1/0233 , H05K1/0245 , H05K1/16 , H05K2201/10287
Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
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