公开(公告)号：US10097151B2

公开(公告)日：2018-10-09

申请号：US15672506

申请日：2017-08-09

Applicant: D-Wave Systems Inc.

Inventor： Murray C. Thom ,  Alexander M. Tcaciuc ,  Gordon Lamont ,  J. Craig Petroff ,  Richard D. Neufeld ,  David S. Bruce ,  Sergey V. Uchaykin

IPC: H03H7/00 ,  H01P1/20 ,  H03H1/00 ,  H01F6/06 ,  H01F41/04 ,  H01L39/14 ,  H01P1/203 ,  H01L39/02 ,  H01F27/28 ,  H03H7/01

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

公开(公告)号：US20200092985A1

公开(公告)日：2020-03-19

申请号：US16562984

申请日：2019-09-06

Applicant: D-WAVE SYSTEMS INC.

Inventor： David S. Bruce ,  Pedro A. de Buen

IPC: H05K1/02 ,  H05K3/46

Abstract: A multilayer filter printed circuit board includes filtering material in one or more filter layers. The filtering material can include superconducting material, normal material, magnetic material and semi-conductor material. The multilayer filter printed circuit board may be used as part of a tubular filter structure. The filtering material may be dispersed in, or on the filter layers in a pattern or at random. The filter layers may have a first and second portion that are co-planar, and comprising different filtering materials from one another. The first and second portion may be electrically isolated from one another. Two or more filter layers may comprise different filtering materials from one another. Additional filter layers comprising filtering material may be formed outward of the outer electrically insulative layers.

公开(公告)号：US20170373658A1

公开(公告)日：2017-12-28

申请号：US15672506

申请日：2017-08-09

Applicant: D-Wave Systems Inc.

Inventor： Murray C. Thom ,  Alexander M. Tcaciuc ,  Gordon Lamont ,  J. Craig Petroff ,  Richard D. Neufeld ,  David S. Bruce ,  Sergey V. Uchaykin

IPC: H03H1/00 ,  H01F6/06 ,  H01L39/02 ,  H01F41/04 ,  H03H7/01 ,  H01P1/203 ,  H01L39/14 ,  H01F27/28

CPC classification number: H03H1/00 ,  H01F6/06 ,  H01F6/065 ,  H01F27/2823 ,  H01F41/048 ,  H01F41/069 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H01P1/203 ,  H03H7/0115 ,  H03H7/0138 ,  H03H7/1741 ,  H03H2001/0078

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.