公开(公告)号：US20170111999A1

公开(公告)日：2017-04-20

申请号：US15172454

申请日：2016-06-03

Applicant: DAEDUCK ELECTRONICS CO., LTD.

Inventor： Jun-Tae AHN ,  Seong-Su CHO

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4697 ,  H05K3/002 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4655 ,  H05K2201/0358

Abstract: This invention discloses a fabricating method of the Printed Circuit Board, comprising the steps of (a) laminating an RCF and a copper layer on the internal core via vacuum press; (b) performing a first curing process; (c) making via-holes and filling out the via-holes and coating the surface of the copper layer with copper plating; (d) preparing a mask layer having a window which exposes the surface of the RCF region for the definition of the cavity; (e) etching the RCF with the surface exposed either via the pumice process or via the wet blast process; and (f) removing the mask layer and performing a second curing process.