公开(公告)号：US09888570B2

公开(公告)日：2018-02-06

申请号：US14068655

申请日：2013-10-31

申请人： International Business Machines Corporation

发明人： Dylan J. Boday ,  Joseph Kuczynski

IPC分类号： H05K1/03 ,  C08L71/12 ,  C08L71/00 ,  B32B17/02 ,  B32B17/06 ,  C03C25/32 ,  C08G65/48 ,  H05K3/02

CPC分类号： H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

摘要： An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

公开(公告)号：US20170349750A1

公开(公告)日：2017-12-07

申请号：US15539467

申请日：2015-06-01

申请人： SHENGYI TECHNOLOGY CO., LTD.

发明人： Suwen YE ,  Guofang TANG

IPC分类号： C08L83/06 ,  C08G77/08 ,  H05K1/03 ,  C08J5/24 ,  B32B38/08 ,  C08K3/00 ,  C08G77/00

CPC分类号： C08L83/06 ,  B32B27/04 ,  B32B38/08 ,  B32B2307/304 ,  B32B2307/3065 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08J5/24 ,  C08K3/013 ,  C08K3/36 ,  C08K5/098 ,  C08L83/04 ,  C09D183/06 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0358 ,  H05K2201/068 ,  C08K5/5415

摘要： The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

公开(公告)号：US20170245358A1

公开(公告)日：2017-08-24

申请号：US15501839

申请日：2015-08-04

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Elisabeth Kreutzwiesner ,  Gernot Schulz

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/22 ,  C23C16/27 ,  H01L23/373 ,  H01L21/48 ,  C23C14/06 ,  C23C14/34 ,  H05K1/09 ,  H01L23/498

CPC分类号： H05K1/0204 ,  B32B5/00 ,  B32B5/02 ,  B32B5/28 ,  B32B7/00 ,  B32B7/02 ,  B32B7/12 ,  B32B9/00 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B2264/00 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2457/00 ,  B32B2457/08 ,  C23C14/0611 ,  C23C14/34 ,  C23C16/276 ,  H01L21/4846 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K3/022 ,  H05K3/22 ,  H05K3/4655 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0358

摘要： A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

公开(公告)号：US09632263B2

公开(公告)日：2017-04-25

申请号：US15029016

申请日：2014-09-11

申请人： NITTO DENKO CORPORATION

发明人： Naoki Shibata ,  Yuichi Tsujita

IPC分类号： G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32

CPC分类号： G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

摘要： In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

公开(公告)号：US20170111999A1

公开(公告)日：2017-04-20

申请号：US15172454

申请日：2016-06-03

申请人： DAEDUCK ELECTRONICS CO., LTD.

发明人： Jun-Tae AHN ,  Seong-Su CHO

IPC分类号： H05K3/46 ,  H05K1/09 ,  H05K3/18 ,  H05K3/00 ,  H05K3/40

CPC分类号： H05K3/4697 ,  H05K3/002 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4655 ,  H05K2201/0358

摘要： This invention discloses a fabricating method of the Printed Circuit Board, comprising the steps of (a) laminating an RCF and a copper layer on the internal core via vacuum press; (b) performing a first curing process; (c) making via-holes and filling out the via-holes and coating the surface of the copper layer with copper plating; (d) preparing a mask layer having a window which exposes the surface of the RCF region for the definition of the cavity; (e) etching the RCF with the surface exposed either via the pumice process or via the wet blast process; and (f) removing the mask layer and performing a second curing process.

公开(公告)号：US20160120077A1

公开(公告)日：2016-04-28

申请号：US14894508

申请日：2014-04-30

申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

发明人： Masahiro WATANABE

IPC分类号： H05K9/00

CPC分类号： H05K9/0084 ,  H05K1/0216 ,  H05K1/0393 ,  H05K9/0081 ,  H05K2201/0358 ,  H05K2203/1178

摘要： An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

摘要翻译： 防止金属薄膜和粘合剂层之间的剥离的电磁波屏蔽膜和使用电磁波屏蔽的印刷线路板。 通过依次层叠至少金属薄膜和粘合剂层来形成电磁波屏蔽膜，根据JISK7129的电磁波屏蔽膜的水蒸汽渗透性在24小时以上为0.5g / m 2， 80摄氏度，湿度为95％RH，压力差为1大气压。

公开(公告)号：US20150353730A1

公开(公告)日：2015-12-10

申请号：US14732121

申请日：2015-06-05

申请人： ELITE MATERIAL CO., LTD.

发明人： CHEN YU HSIEH

IPC分类号： C08L77/06 ,  H05K1/03

CPC分类号： C08L77/06 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1082 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5399 ,  C08L23/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

摘要： A resin composition, including (A) a polyimide resin; (B) a pre-polymerised maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerised maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

摘要翻译： 一种树脂组合物，其包含（A）聚酰亚胺树脂; （B）预聚合的马来酰亚胺树脂; （C）热固性树脂; 和（D）阻燃剂。 用于合成聚酰亚胺树脂的反应物包括酸酐和二胺，二胺包括4,4'-二氨基二苯基甲烷及其类似化合物和聚醚二胺。 树脂组合物具有以下优点：由树脂组合物制成的树脂膜或预浸料包含由特定结构的二胺和预聚合的马来酰亚胺树脂合成的聚酰亚胺树脂，以达到电路层压材料的令人满意的特性， 例如低介电常数，低损耗因数，高耐热性和高粘合性，以用于制造金属包覆层压板和印刷电路板。

公开(公告)号：US08815334B2

公开(公告)日：2014-08-26

申请号：US12368019

申请日：2009-02-09

申请人： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

发明人： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC分类号： B05D5/12 ,  H05K3/00

CPC分类号： H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

摘要： The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

摘要翻译： 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US08591750B2

公开(公告)日：2013-11-26

申请号：US12659893

申请日：2010-03-24

申请人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

发明人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

IPC分类号： H01B13/00 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

摘要翻译： 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

公开(公告)号：US20130105200A1

公开(公告)日：2013-05-02

申请号：US13807254

申请日：2011-06-29

申请人： Noriyuki Ohigashi ,  Tadasuke Endo

发明人： Noriyuki Ohigashi ,  Tadasuke Endo

IPC分类号： B32B19/02 ,  H05K1/02

CPC分类号： B32B19/02 ,  B32B17/04 ,  C08J5/24 ,  C08J2363/00 ,  H01L2224/16227 ,  H05K1/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/2495 ,  Y10T428/252

摘要： An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.

摘要翻译： 本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是 与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层， 形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上 层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。