公开(公告)号：US20240237233A9

公开(公告)日：2024-07-11

申请号：US18271544

申请日：2021-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20240023242A1

公开(公告)日：2024-01-18

申请号：US18471816

申请日：2023-09-21

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. BUSS ,  Theresa M. BESOZZI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/09 ,  H05K1/05 ,  H05K2201/0358

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US09888570B2

公开(公告)日：2018-02-06

申请号：US14068655

申请日：2013-10-31

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski

IPC: H05K1/03 ,  C08L71/12 ,  C08L71/00 ,  B32B17/02 ,  B32B17/06 ,  C03C25/32 ,  C08G65/48 ,  H05K3/02

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

公开(公告)号：US20170349750A1

公开(公告)日：2017-12-07

申请号：US15539467

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Suwen YE ,  Guofang TANG

IPC: C08L83/06 ,  C08G77/08 ,  H05K1/03 ,  C08J5/24 ,  B32B38/08 ,  C08K3/00 ,  C08G77/00

CPC classification number: C08L83/06 ,  B32B27/04 ,  B32B38/08 ,  B32B2307/304 ,  B32B2307/3065 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08J5/24 ,  C08K3/013 ,  C08K3/36 ,  C08K5/098 ,  C08L83/04 ,  C09D183/06 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0358 ,  H05K2201/068 ,  C08K5/5415

Abstract: The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

公开(公告)号：US20170245358A1

公开(公告)日：2017-08-24

申请号：US15501839

申请日：2015-08-04

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Elisabeth Kreutzwiesner ,  Gernot Schulz

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/22 ,  C23C16/27 ,  H01L23/373 ,  H01L21/48 ,  C23C14/06 ,  C23C14/34 ,  H05K1/09 ,  H01L23/498

CPC classification number: H05K1/0204 ,  B32B5/00 ,  B32B5/02 ,  B32B5/28 ,  B32B7/00 ,  B32B7/02 ,  B32B7/12 ,  B32B9/00 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B2264/00 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2457/00 ,  B32B2457/08 ,  C23C14/0611 ,  C23C14/34 ,  C23C16/276 ,  H01L21/4846 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K3/022 ,  H05K3/22 ,  H05K3/4655 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0358

Abstract: A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.

公开(公告)号：US09632263B2

公开(公告)日：2017-04-25

申请号：US15029016

申请日：2014-09-11

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Yuichi Tsujita

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

公开(公告)号：US20170111999A1

公开(公告)日：2017-04-20

申请号：US15172454

申请日：2016-06-03

Applicant: DAEDUCK ELECTRONICS CO., LTD.

Inventor： Jun-Tae AHN ,  Seong-Su CHO

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4697 ,  H05K3/002 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4655 ,  H05K2201/0358

Abstract: This invention discloses a fabricating method of the Printed Circuit Board, comprising the steps of (a) laminating an RCF and a copper layer on the internal core via vacuum press; (b) performing a first curing process; (c) making via-holes and filling out the via-holes and coating the surface of the copper layer with copper plating; (d) preparing a mask layer having a window which exposes the surface of the RCF region for the definition of the cavity; (e) etching the RCF with the surface exposed either via the pumice process or via the wet blast process; and (f) removing the mask layer and performing a second curing process.

公开(公告)号：US20160120077A1

公开(公告)日：2016-04-28

申请号：US14894508

申请日：2014-04-30

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Masahiro WATANABE

IPC: H05K9/00

CPC classification number: H05K9/0084 ,  H05K1/0216 ,  H05K1/0393 ,  H05K9/0081 ,  H05K2201/0358 ,  H05K2203/1178

Abstract: An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

Abstract translation: 防止金属薄膜和粘合剂层之间的剥离的电磁波屏蔽膜和使用电磁波屏蔽的印刷线路板。 通过依次层叠至少金属薄膜和粘合剂层来形成电磁波屏蔽膜，根据JISK7129的电磁波屏蔽膜的水蒸汽渗透性在24小时以上为0.5g / m 2， 80摄氏度，湿度为95％RH，压力差为1大气压。

公开(公告)号：US20150353730A1

公开(公告)日：2015-12-10

申请号：US14732121

申请日：2015-06-05

Applicant: ELITE MATERIAL CO., LTD.

Inventor： CHEN YU HSIEH

IPC: C08L77/06 ,  H05K1/03

CPC classification number: C08L77/06 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1082 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5399 ,  C08L23/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerised maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerised maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Abstract translation: 一种树脂组合物，其包含（A）聚酰亚胺树脂; （B）预聚合的马来酰亚胺树脂; （C）热固性树脂; 和（D）阻燃剂。 用于合成聚酰亚胺树脂的反应物包括酸酐和二胺，二胺包括4,4'-二氨基二苯基甲烷及其类似化合物和聚醚二胺。 树脂组合物具有以下优点：由树脂组合物制成的树脂膜或预浸料包含由特定结构的二胺和预聚合的马来酰亚胺树脂合成的聚酰亚胺树脂，以达到电路层压材料的令人满意的特性， 例如低介电常数，低损耗因数，高耐热性和高粘合性，以用于制造金属包覆层压板和印刷电路板。

公开(公告)号：US08815334B2

公开(公告)日：2014-08-26

申请号：US12368019

申请日：2009-02-09

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: B05D5/12 ,  H05K3/00

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。