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公开(公告)号:US20240030114A1
公开(公告)日:2024-01-25
申请号:US18375193
申请日:2023-09-29
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor: Masahiro NAGATA , Kazuhiro SHINOZAKI , Masahiro YAMADA , Daisuke OKUYAMA , Chiaki HATSUTA , Kentarou SEKI , Hideto MATSUI , Kazunori OOUCHI
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L23/49582 , H01L21/4828
Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
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公开(公告)号:US20240145356A1
公开(公告)日:2024-05-02
申请号:US18279608
申请日:2022-09-01
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor: Masahiro NAGATA , Kazuhiro SHINOZAKI , Masahiro YAMADA , Daisuke OKUYAMA , Chiaki HATSUTA , Kentarou SEKI , Hideto MATSUI , Kazunori OOUCHI
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L23/49582 , H01L21/4842 , H01L23/49513 , H01L24/48 , H01L2224/48245
Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
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公开(公告)号:US20190169733A1
公开(公告)日:2019-06-06
申请号:US16267798
申请日:2019-02-05
Applicant: Dai Nippon Printing Co., Ltd.
Inventor: Chikao IKENAGA , Yo SHIMAZAKI , Kentarou SEKI , Hiroki FURUSHOU , Chiaki HATSUTA
Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
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公开(公告)号:US20240404928A1
公开(公告)日:2024-12-05
申请号:US18678270
申请日:2024-05-30
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor: Masahiro NAGATA , Kazuhiro SHINOZAKI , Masahiro YAMADA , Daisuke OKUYAMA , Chiaki HATSUTA , Kentarou SEKI , Hideto MATSUI , Kazunori OOUCHI
IPC: H01L23/495 , C23C18/22 , H01L21/48 , H01L23/00 , H01L23/31
Abstract: A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
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公开(公告)号:US20180334740A1
公开(公告)日:2018-11-22
申请号:US15763595
申请日:2016-09-29
Applicant: Dai Nippon Printing co., Ltd.
Inventor: Chikao IKENAGA , Yo SHIMAZAKI , Kentarou SEKI , Hiroki FURUSHOU , Chiaki HATSUTA
Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
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