公开(公告)号：US20200328317A1

公开(公告)日：2020-10-15

申请号：US16381478

申请日：2019-04-11

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kosuke SAEKI ,  Shinya YONEDA ,  Jun TANAKA ,  Hiroaki TAMAKI ,  Shinsuke NAGINO ,  Naohiro OBONAI

IPC: H01L31/048 ,  H01L31/049 ,  B32B27/08 ,  B32B27/32 ,  B32B37/15

Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer 11 has a density of 0.880 g/cm3 to 0.930 g/cm3 and a melting point of 70° C. or higher, a skin layer 12 has a density of 0.880 g/cm3 to 0.900 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 12 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer 12 in the whole resin component is 300 ppm to 2000 ppm.

公开(公告)号：US20240313141A1

公开(公告)日：2024-09-19

申请号：US18653452

申请日：2024-05-02

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kosuke SAEKI ,  Shinya Yoneda ,  Jun Tanaka ,  Hiroaki Tamaki ,  Shinsuke Nagino ,  Naohiro Obonai

IPC: H01L31/048 ,  B32B27/08 ,  B32B27/32 ,  B32B37/15 ,  H01L31/049

CPC classification number: H01L31/0481 ,  B32B27/08 ,  B32B27/32 ,  B32B37/153 ,  H01L31/0488 ,  H01L31/049 ,  B32B2307/72 ,  B32B2457/12

Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer has a density of 0.880 g/cm3 to 0.895 g/cm3 and a melting point of 70° C. or higher, a skin layer has a density of 0.880 g/cm3 to 0.910 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 11 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer in the whole resin component is 300 ppm to 2000 ppm.

公开(公告)号：US20220352404A1

公开(公告)日：2022-11-03

申请号：US17866692

申请日：2022-07-18

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kosuke SAEKI ,  Shinya YONEDA ,  Jun TANAKA ,  Hiroaki TAMAKI ,  Shinsuke NAGINO ,  Naohiro OBONAI

IPC: H01L31/048 ,  B32B7/022 ,  B32B27/08 ,  B32B27/32 ,  B32B37/10 ,  H01L31/18 ,  B32B37/02

Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.

公开(公告)号：US20250081687A1

公开(公告)日：2025-03-06

申请号：US18727541

申请日：2023-01-11

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Yoshihiro KANAI ,  Atsuo TSUZUKI ,  Marii NISHIKAWA ,  Kosuke SAEKI ,  Shunsuke FURUYA

IPC: H01L33/56 ,  G02F1/13357 ,  H01L25/075

Abstract: A surface-emitting device includes: a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate; and a sealing member placed on a light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element; wherein the light-emitting diode element includes a transparent substrate including inorganic material, and a light-emitting layer formed on one surface of the transparent substrate; the light-emitting diode element is a bare chip in which the transparent substrate is exposed on a surface thereof; the sealing member is in contact with the transparent substrate on a side surface and a surface opposite side to a surface where the light-emitting layer is formed; and a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element.

公开(公告)号：US20230099082A1

公开(公告)日：2023-03-30

申请号：US17958948

申请日：2022-10-03

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kosuke SAEKI ,  Shinya YONEDA ,  Jun TANAKA ,  Hiroaki TAMAKI ,  Shinsuke NAGINO ,  Naohiro OBONAI

IPC: H01L31/048 ,  H01L31/049 ,  B32B27/32 ,  B32B37/15 ,  B32B27/08

Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer has a density of 0.880 g/cm3 to 0.895 g/cm3 and a melting point of 70° C. or higher, a skin layer has a density of 0.880 g/cm3 to 0.910 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 11 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer in the whole resin component is 300 ppm to 2000 ppm.

公开(公告)号：US20200328316A1

公开(公告)日：2020-10-15

申请号：US16381199

申请日：2019-04-11

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kosuke SAEKI ,  Shinya YONEDA ,  Jun TANAKA ,  Hiroaki TAMAKI ,  Shinsuke NAGINO ,  Naohiro OBONAI

IPC: H01L31/048 ,  B32B7/022 ,  B32B27/08 ,  B32B27/32 ,  B32B37/10 ,  B32B37/02 ,  H01L31/18

Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.