公开(公告)号：US20250081687A1

公开(公告)日：2025-03-06

申请号：US18727541

申请日：2023-01-11

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Yoshihiro KANAI ,  Atsuo TSUZUKI ,  Marii NISHIKAWA ,  Kosuke SAEKI ,  Shunsuke FURUYA

IPC: H01L33/56 ,  G02F1/13357 ,  H01L25/075

Abstract: A surface-emitting device includes: a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate; and a sealing member placed on a light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element; wherein the light-emitting diode element includes a transparent substrate including inorganic material, and a light-emitting layer formed on one surface of the transparent substrate; the light-emitting diode element is a bare chip in which the transparent substrate is exposed on a surface thereof; the sealing member is in contact with the transparent substrate on a side surface and a surface opposite side to a surface where the light-emitting layer is formed; and a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element.

公开(公告)号：US20230378403A1

公开(公告)日：2023-11-23

申请号：US18031261

申请日：2021-10-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita ARIHARA ,  Marii NISHIKAWA ,  Atsuo TSUZUKI ,  Yoshihiro KANAI

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/56 ,  H01L33/54

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/54

Abstract: A surface-emitting device includes: a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate; a sealing member placed on a light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element; and a diffusion member placed on the sealing member, on an opposite surface side to the light-emitting diode substrate side, wherein a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element.