公开(公告)号：US10711162B2

公开(公告)日：2020-07-14

申请号：US15028147

申请日：2014-10-06

Applicant: DAICEL CORPORATION

Inventor： Yousuke Ito ,  Hiroki Tanaka ,  Kiyoharu Tsutsumi

IPC: C09J5/06 ,  C09J4/00 ,  C09J5/00 ,  C09J201/02 ,  C09J11/06 ,  C09J125/08 ,  C09J125/18 ,  C09J133/06

Abstract: Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows:

公开(公告)号：US10047257B2

公开(公告)日：2018-08-14

申请号：US15025143

申请日：2014-09-25

Applicant: DAICEL CORPORATION

Inventor： Hiroki Tanaka ,  Katsuhiro Nakaguchi ,  Kiyoharu Tsutsumi ,  Yousuke Ito ,  Naoko Tsuji

IPC: H01L21/00 ,  C09J163/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00 ,  C08G59/68 ,  C09J7/35 ,  H01L23/29

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.