公开(公告)号：US20250034385A1

公开(公告)日：2025-01-30

申请号：US18834883

申请日：2023-01-31

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Shinsuke ISHIKAWA ,  Yuichi FUJIOKA ,  Mitsuteru MUTSUDA ,  Tomoki KITAGAWA

IPC: C08L23/20 ,  C08K5/14 ,  C08L9/06 ,  C08L53/02 ,  H05K1/03

Abstract: The present disclosure provides a thermosetting resin composition and the like, from which is obtained a cured product that excels in dielectric properties with respect to high-frequency radio waves. The thermosetting resin composition and the like of the present disclosure contain a thermosetting resin having a plurality of ethylenically unsaturated groups per molecule. The ethylenically unsaturated groups are carbon-carbon double bonds each containing two carbon atoms. A percentage of a number of ethylenically unsaturated groups in which both of the two carbon atoms are bonded to one or two atoms other than a hydrogen atom by single bonds is 50% or greater, with proviso that the total number of the ethylenically unsaturated groups is 100%. Alternatively, a dielectric loss tangent at 40 GHz of a cured product of the thermosetting resin composition is smaller than a dielectric loss tangent at 10 GHz of the cured product.