公开(公告)号：US20200376720A1

公开(公告)日：2020-12-03

申请号：US16970844

申请日：2019-02-18

Applicant: DAICEL CORPORATION ,  TOKYO INSTITUTE OF TECHNOLOGY ,  UNIVERSITY PUBLIC CORPORATION OSAKA

Inventor： Shinsuke ISHIKAWA ,  Takeshi FUJIKAWA ,  Yuki ONISHI ,  Yoshihiko HIRAI

IPC: B29C33/38 ,  B29D11/00 ,  B29C35/08

Abstract: Provided is a mold production method whereby a UV curable composition can be molded with good precision through optical imprinting. The mold production method of the present invention is a method of producing a mold including an elastic body and used for molding a UV curable composition, and the method includes simulating deformation associated with curing of the UV curable composition using finite element analysis using [1] curing shrinkage of the UV curable composition and [2] deformation of the mold associated with the curing shrinkage, and designing the mold in accordance with a result of the simulation.

公开(公告)号：US20250034385A1

公开(公告)日：2025-01-30

申请号：US18834883

申请日：2023-01-31

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Shinsuke ISHIKAWA ,  Yuichi FUJIOKA ,  Mitsuteru MUTSUDA ,  Tomoki KITAGAWA

IPC: C08L23/20 ,  C08K5/14 ,  C08L9/06 ,  C08L53/02 ,  H05K1/03

Abstract: The present disclosure provides a thermosetting resin composition and the like, from which is obtained a cured product that excels in dielectric properties with respect to high-frequency radio waves. The thermosetting resin composition and the like of the present disclosure contain a thermosetting resin having a plurality of ethylenically unsaturated groups per molecule. The ethylenically unsaturated groups are carbon-carbon double bonds each containing two carbon atoms. A percentage of a number of ethylenically unsaturated groups in which both of the two carbon atoms are bonded to one or two atoms other than a hydrogen atom by single bonds is 50% or greater, with proviso that the total number of the ethylenically unsaturated groups is 100%. Alternatively, a dielectric loss tangent at 40 GHz of a cured product of the thermosetting resin composition is smaller than a dielectric loss tangent at 10 GHz of the cured product.