公开(公告)号：US11215227B2

公开(公告)日：2022-01-04

申请号：US16931704

申请日：2020-07-17

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Masahiro Nakai

IPC: F16C33/12 ,  B32B15/01 ,  C22C9/00 ,  C22C9/02 ,  B22D19/08 ,  B22D19/00 ,  B22D13/02

Abstract: A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. A cross-sectional structure of the sliding layer includes first copper alloy grains in contact with a bonding surface and second copper alloy grains not in contact with the bonding surface. The first and second grains have an average grain size D1 and D2 respectively. D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3. In the cross-sectional structure, the second grains includes third grains that includes internal grains therein that are not in contact with a grain boundary of the third grains. A total area S1 of the third grains and a total area of the second copper alloy grains S2 satisfy: S0/S2=0.25 to 0.80.

公开(公告)号：US11193536B2

公开(公告)日：2021-12-07

申请号：US16931689

申请日：2020-07-17

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Masahiro Nakai

IPC: F16C33/12 ,  B32B15/01 ,  C22C9/00 ,  F16C33/00 ,  F16C17/00

Abstract: A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. The sliding layer has a cross-sectional structure perpendicular to a sliding surface of the sliding layer. The cross-sectional structure includes first copper alloy grains that are in contact with a bonding surface of the back-metal layer and second copper alloy grains that are not in contact with the bonding surface. The first copper alloy grains has an average grain size D1 and the second copper alloy grains has an average grain size D2. D1 and D2 satisfy the following relations: D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3.