Light-emitting keyswitch, cap structure and cap structure manufacturing method thereof

    公开(公告)号:US10892121B2

    公开(公告)日:2021-01-12

    申请号:US16795608

    申请日:2020-02-20

    IPC分类号: H01H13/83 H01H13/7065

    摘要: A light-emitting keyswitch includes a board, a lifting mechanism and a cap structure. The cap structure is assembled with the lifting mechanism to be movable upward and downward relative to the board and includes a cap and a light-emitting layer. The light-emitting layer includes first and second pad layers disposed on a lateral contour surface of the cap and spaced from each other, a lower electrode layer, a dielectric layer, an electroluminescent layer, an upper electrode layer and a transparent pattern layer stacked on a top surface of the cap, and an external trace structure. The lower and upper electrode layers are connected to the first and second pad layers respectively. The external trace structure is connected to the first and second pad layers for transmitting power to the upper and lower electrode layers, so as to drive the electroluminescent layer to emit light to the transparent pattern layer.

    LIGHT-EMITTING KEYSWITCH, CAP STRUCTURE AND CAP STRUCTURE MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200294739A1

    公开(公告)日:2020-09-17

    申请号:US16795608

    申请日:2020-02-20

    IPC分类号: H01H13/83 H01H13/7065

    摘要: A light-emitting keyswitch includes a board, a lifting mechanism and a cap structure. The cap structure is assembled with the lifting mechanism to be movable upward and downward relative to the board and includes a cap and a light-emitting layer. The light-emitting layer includes first and second pad layers disposed on a lateral contour surface of the cap and spaced from each other, a lower electrode layer, a dielectric layer, an electroluminescent layer, an upper electrode layer and a transparent pattern layer stacked on a top surface of the cap, and an external trace structure. The lower and upper electrode layers are connected to the first and second pad layers respectively. The external trace structure is connected to the first and second pad layers for transmitting power to the upper and lower electrode layers, so as to drive the electroluminescent layer to emit light to the transparent pattern layer.

    TRANSPARENT KEYCAP MANUFACTURING METHOD AND TRANSPARENT KEYCAP THEREOF

    公开(公告)号:US20230128037A1

    公开(公告)日:2023-04-27

    申请号:US17732550

    申请日:2022-04-29

    IPC分类号: B44C1/22 H01H13/88

    摘要: A transparent keycap manufacturing method includes adhering an opaque base to a fixing film, performing a laser engraving process or an etching process on a bottom surface of the opaque base to generate a continuous hollow pattern region and a pattern component surrounded by the continuous hollow pattern region, coating transparent glue on the bottom surface of the opaque base to fill the continuous hollow pattern region with the transparent glue, adhering a transparent base to the bottom surface of the opaque base, and removing the fixing film from the opaque base.

    CAP STRUCTURE AND KEYSWITCH THEREOF
    4.
    发明申请

    公开(公告)号:US20190237279A1

    公开(公告)日:2019-08-01

    申请号:US16248794

    申请日:2019-01-16

    IPC分类号: H01H13/83 H05K1/18 G06K9/00

    摘要: A cap structure is combined with a lifting mechanism to be movable between a pressed position and a non-pressed position. The cap structure includes a first circuit, a second circuit, a flexible circuit board and a cap having a top surface, a bottom surface and an engaging structure. The engaging structure protrudes from the bottom surface for engaging with the lifting mechanism. The first circuit is laid out on the top surface for connecting to a sensing device or a display device attached on the top surface. The second circuit is laid out on the bottom surface and avoids the engaging structure. The second circuit passes through the cap to be connected to the first circuit. The flexible circuit board is connected to the second circuit for performing signal transmission of the sensing device or the display device via the first and second circuits.

    Keycap and manufacturing method thereof

    公开(公告)号:US09984834B2

    公开(公告)日:2018-05-29

    申请号:US14701619

    申请日:2015-05-01

    IPC分类号: H01H11/00 H01H13/04 H01H13/88

    摘要: A method of manufacturing keycaps, each keycap having a top and a skirt, includes: providing a first jig having a plurality of positioning units; arranging correspondingly a plurality of keycaps onto the plurality of positioning units; attaching a first film including an ink layer and a first release layer to the plurality of keycaps by using an out-mold transfer technique, such that the first film covers respective upper surfaces of the tops and respective side surfaces of the skirts of keycaps; removing the first release film; laser-engraving the ink layer; and forming a protection layer on the laser-engraved ink layer. A keycap manufactured by the method of the present invention is also disclosed.

    KEYCAP AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    KEYCAP AND METHOD OF MANUFACTURING THE SAME 审中-公开
    键盘及其制造方法

    公开(公告)号:US20130248337A1

    公开(公告)日:2013-09-26

    申请号:US13776713

    申请日:2013-02-26

    IPC分类号: H01H9/02 B29C59/16

    摘要: A keycap and a method of manufacturing the same are disclosed. The method is to injection-mold a cap with a layer structure of ink thereon by an in-mold transfer method; then, to form a pattern on the layer structure of ink by a high energy optical engraving method; and at last, to form a light-permeable protection layer on the layer structure of ink to cover the pattern. The keycap according to the invention is therefore obtained. Therefore, the invention can reduce the manufacturing time relatively to a conventional keycap with a pattern formed thereon, such as a keycap for backlight keyboard. Furthermore, the invention can improve the binding strength between the layer structure of ink and the cap by use of the in-mold transfer method.

    摘要翻译: 公开了一种键帽及其制造方法。 该方法是通过模内转印法将具有油墨层结构的盖注塑成型; 然后通过高能光学雕刻方法在油墨层结构上形成图案; 并且最后在油墨的层结构上形成透光保护层以覆盖图案。 因此获得了本发明的键帽。 因此,本发明可以相对于其上形成有图案的常规键帽例如用于背光键盘的键帽来缩短制造时间。 此外,本发明可以通过使用模内转印方法来改善油墨层和结构层之间的结合强度。