公开(公告)号：US20240355557A1

公开(公告)日：2024-10-24

申请号：US18359010

申请日：2023-07-26

Applicant: WISTRON CORP.

Inventor： SHIH TING TING ,  Yuyin Liu ,  ZI-FENG HUANG ,  ZHI-YANG XIAN ,  YULUN CHIANG

IPC: H01H13/02 ,  H01H13/14 ,  H01H13/83 ,  H05K1/18

CPC classification number: H01H13/023 ,  H01H13/14 ,  H01H13/83 ,  H05K1/18 ,  H01H2219/016 ,  H01H2219/037 ,  H01H2219/04 ,  H01H2219/046 ,  H01R12/79 ,  H05K2201/09072 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10189 ,  H05K2201/10537 ,  H05K2201/10545

Abstract: A key module includes a circuit assembly, a support assembly and a display assembly. The support assembly is movably disposed on the circuit assembly. The display assembly includes a digital display unit. The digital display unit is supported on the circuit assembly by the support assembly, and the digital display unit is electrically connected to the circuit assembly.

公开(公告)号：US20240349421A1

公开(公告)日：2024-10-17

申请号：US18415699

申请日：2024-01-18

Applicant: REALTEK SEMICONDUCTOR CORPORATION

Inventor： CHIA-LUNG WANG ,  Min-Hung Huang

IPC: H05K1/02 ,  H01L23/538

CPC classification number: H05K1/0292 ,  H01L23/5382 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10363

Abstract: A layout without bridge taps includes: a routing from a CPU to a first module through a first set of pads; a routing from a first set of bridge pads to a second module through a second set of pads and a second set of bridge pads; a routing from a third set of pads to a third module; and connectors. The connectors connect pads of the first set of pads to couple the CPU with the first module, or connect the first set of pads with the first set of bridge pads and connect the second set of pads with the second set of bridge pads to couple the CPU with the second module, or connect the first set of pads with the first set of bridge pads and connect the second set of pads with the third set of pads to couple the CPU with the third module.

公开(公告)号：US12113402B2

公开(公告)日：2024-10-08

申请号：US17392650

申请日：2021-08-03

Applicant: BLACK & DECKER INC.

Inventor： Eric W. Wachter ,  Erik A. Ekstrom ,  Alpay Hizal

IPC: H02K11/30 ,  H05K1/02 ,  H05K7/14

CPC classification number: H02K11/30 ,  H05K1/0213 ,  H05K7/1427 ,  H05K2201/10053 ,  H05K2201/1009 ,  H05K2201/10151

Abstract: An electronic switch module includes a circuit board having conductive pads coupled to a power source and a sense pad coupled to an output signal; and a variable-speed actuator assembly having an actuator positioned adjacent a side edge of the circuit board and moveable along a movement axis, a plunger coupled to the actuator, and a conductive wiper secured to the plunger in contact with the circuit board. The wiper includes a first leg arranged to slidably engage the sense pad and a second leg arranged to slidably engage at least one of the conductive pads. The sense pad is longitudinally aligned with the conductive pads. The first leg of the wiper is located between the actuator and the second leg, and the sense pad is located between the side edge of the circuit board and the conductive pads.

公开(公告)号：US20240313645A1

公开(公告)日：2024-09-19

申请号：US18602648

申请日：2024-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sho OKAMOTO ,  Muneharu KATO ,  Kouji YAMAGUCHI

IPC: H02M3/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H02M3/003 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10053

Abstract: A power supply system is provided that includes a first board, a tracker module disposed at the first board, and a power inductor disposed at the first board. The tracker module includes a second board and at least one IC chip disposed at the second board. The at least one IC chip includes at least one switch included in a pre-regulator circuit, at least one switch included in a switched-capacitor circuit, and at least one switch included in a supply modulator. In a plan view in a thickness direction of the first board, the second board has a recess, and at least a portion of the power inductor is disposed in the recess.

公开(公告)号：US20240270566A1

公开(公告)日：2024-08-15

申请号：US18022145

申请日：2022-03-31

Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hao YAN ,  Yulin FENG ,  Yue LI ,  Chuncheng CHE

IPC: B81B7/00 ,  B81C99/00 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: B81B7/0006 ,  B81C99/00 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  B81B2201/014 ,  B81B2203/0118 ,  H05K2201/10053 ,  H05K2201/1006

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite to each other in a thickness direction of the substrate, wherein the substrate has first and second connection vias which penetrate through the substrate in the thickness direction of the substrate, and first and second conductive pillars are respectively in the first connection via and the second connection via; a switch on the first surface of the substrate and comprising first and second signal electrodes, wherein the first signal electrode is electrically coupled to a first terminal of the first conductive pillar, and the second signal electrode is electrically coupled to a first terminal of the second conductive pillar; and a filter on the second surface of the substrate.

公开(公告)号：US12004713B2

公开(公告)日：2024-06-11

申请号：US17371236

申请日：2021-07-09

Applicant: OLYMPUS WINTER & IBE GMBH

Inventor： Alrun Thuemen ,  Uwe Schoeler ,  Jens Schnitger

IPC: A61B1/00 ,  H05K1/18

CPC classification number: A61B1/00124 ,  A61B1/00066 ,  A61B1/0011 ,  A61B1/00128 ,  H05K1/189 ,  H05K2201/10053

Abstract: A connection body for use with an endoscope that provides an electrical connection between at least one electrical component arranged in a proximal end region of the endoscope and an internal electrical connection provided in the proximal end region. The connection body including: a dimensionally stable three-dimensional circuit carrier: and a flexible elongate circuit board. Where, in a first region of the circuit carrier, the electrical component is mechanically directly connected to the circuit carrier and is contacted by conductor tracks provided in the circuit carrier; in a second region different from the first region, a first end of the circuit board is mechanically directly connected to the circuit carrier and contacts the conductor tracks for electrical connection to the electrical component and a second end of the circuit board opposite the first end in a longitudinal direction of the circuit board, contacts the internal electrical connection.

公开(公告)号：US20240138488A1

公开(公告)日：2024-05-02

申请号：US18405684

申请日：2024-01-05

Applicant: JAPAN TOBACCO INC.

Inventor： Minoru KITAHARA ,  Shujiro TANAKA ,  Yasuhiro ONO

IPC: A24F40/57 ,  H05B1/02 ,  H05B6/06 ,  H05K1/18

CPC classification number: A24F40/57 ,  H05B1/0244 ,  H05B6/06 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10053

Abstract: A power supply unit of an aerosol generating device includes: a power supply; a connector to which a load configured to generate aerosol from an aerosol source by consuming electric power supplied from the power supply, or a coil configured to transmit electric power to the load by electromagnetic induction is connected; a voltage converter that has an input terminal connected to the power supply and an output terminal connected to the connector; a first capacitor and a second capacitor connected between the output terminal of the voltage converter and the connector; and a circuit substrate on which the voltage converter, the first capacitor, and the second capacitor are mounted. The first capacitor and the second capacitor are not arranged in a line in a length direction or a width direction of the circuit substrate.

公开(公告)号：US11949407B2

公开(公告)日：2024-04-02

申请号：US18062429

申请日：2022-12-06

Applicant: Zonit Structured Solutions, LLC

Inventor： Steve Chapel ,  William Pachoud

IPC: H03K17/13 ,  H03K17/687 ,  H05K1/02 ,  H05K3/30

CPC classification number: H03K17/133 ,  H03K17/687 ,  H05K1/0204 ,  H05K3/306 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/2036 ,  Y10T29/4913

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

公开(公告)号：US11827143B2

公开(公告)日：2023-11-28

申请号：US17308609

申请日：2021-05-05

Applicant: Honda Motor Co., Ltd.

Inventor： Patricia A. Scott ,  Zainab I. Ali

IPC: B60Q3/233 ,  H05K1/02 ,  B60Q3/283 ,  B60Q3/54 ,  B60R13/02 ,  H05K1/03 ,  B60Q3/74 ,  B60Q3/82 ,  H05K3/28 ,  B60Q3/80 ,  H05K3/00 ,  H05K1/09 ,  H05K1/18

CPC classification number: B60Q3/233 ,  B60Q3/283 ,  B60Q3/54 ,  B60Q3/745 ,  B60Q3/80 ,  B60Q3/82 ,  B60R13/02 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/0393 ,  H05K3/284 ,  B60R2013/0287 ,  H05K1/032 ,  H05K1/095 ,  H05K1/181 ,  H05K3/0014 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/0143

Abstract: A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.

公开(公告)号：US20230318459A1

公开(公告)日：2023-10-05

申请号：US18206802

申请日：2023-06-07

Applicant: Infineon Technologies Austria AG

Inventor： Kennith K. Leong ,  Matthias J. Kasper ,  Luca Peluso ,  Gerald Deboy

IPC: H02M3/158 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H02M7/00 ,  H05K1/18 ,  H05K3/32 ,  H02M3/335

CPC classification number: H02M3/1584 ,  H01F27/24 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/04 ,  H02M7/003 ,  H05K1/181 ,  H05K3/32 ,  H02M3/33573 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10189 ,  H02M3/003

Abstract: According to one configuration, an inductor device comprises: core material and one or more electrically conductive paths. The core material is magnetically permeable and surrounds (envelops) the one or more electrically conductive paths. Each of the electrically conductive paths extends through the core material of the inductor device from a first end of the inductor device to a second end of the inductor device. The magnetically permeable core material is operative to confine (guide, carry, convey, localize, etc.) respective magnetic flux generated from current flowing through a respective electrically conductive path. The core material stores the magnetic flux energy (i.e., first magnetic flux) generated from the current flowing through the first electrically conductive path. One configuration herein includes a power converter assembly comprising a stack of components including the inductor device as previously described as well as a first power interface, a second power interface, and one or more switches.