公开(公告)号：US20140305481A1

公开(公告)日：2014-10-16

申请号：US13925199

申请日：2013-06-24

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SCOTT D. BRANDENBURG ,  KHALID M. ELTOM ,  GARY L. EESLEY ,  BRUCE A. MYERS ,  BRUCE MOOR

IPC: H01L35/30

CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The assembly includes a first heat exchanger configured to guide exhaust gas of an internal combustion engine past an opening defined by the first heat exchanger, and a heat sink configured to couple thermally the TEG to the exhaust gas and fluidicly seal the opening. The assembly is configured so the heat sink is directly exposed to the exhaust gas so that heat is efficiently transferred from the exhaust gas to the TEG.

Abstract translation: 一种用于将热电发生器（TEG）热耦合到内燃机的排气歧管的组件。 组件包括：第一热交换器，其被配置为引导内燃机的废气经过由第一热交换器限定的开口;以及散热器，该散热器被配置为将TEG热耦合到废气并且流体地密封该开口。 组件被配置为使得散热器直接暴露于废气，使得热量有效地从排气转移到TEG。

公开(公告)号：US20130279113A1

公开(公告)日：2013-10-24

申请号：US13917921

申请日：2013-06-14

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SCOTT D. BRANDENBURG ,  RICHARD D. PARKER ,  KHALID M. ELTOM

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 液体冷却的电力电子组件被配置为使用导电冷却剂来冷却功率电子设备，所述电子设备使用围绕电介质板的周边的金属套筒密封的电介质板，以形成器件组件。 该配置允许电子设备和冷却剂之间的更直接接触，同时保护电子设备免受潜在导电的冷却剂的接触。 用于形成电介质板和壳体的材料被选择为具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

公开(公告)号：US20140305480A1

公开(公告)日：2014-10-16

申请号：US13861787

申请日：2013-04-12

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SCOTT D. BRANDENBURG ,  KHALID M. ELTOM ,  BRUCE A. MYERS ,  GARY L. EESLEY ,  BRUCE MOOR

IPC: H01L35/30

CPC classification number: H01L35/30 ,  H01L35/32

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger configured to couple thermally heat from exhaust gas to an outer surface of the first heat exchanger. The outer surface is preferably formed of stainless steel. A first dielectric layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger. A first conductor layer is formed by firing a conductive thick-film onto the first dielectric layer. A first paste layer of silver (Ag) based sintering paste is interposed between the first conductor layer and a first contact of the TEG. The first contact is sintered to the first conductor layer when the assembly is suitably arranged and suitably heated.

Abstract translation: 一种用于将热电发生器（TEG）热耦合到内燃机的排气歧管的组件。 排气歧管形成第一热交换器，其构造成将来自废气的热热耦合到第一热交换器的外表面。 外表面优选由不锈钢形成。 通过将厚膜电介质材料烧制到第一热交换器的不锈钢上而形成第一电介质层。 通过在第一电介质层上烧结导电厚膜来形成第一导体层。 银（Ag）基烧结膏的第一糊剂层插入在第一导体层和TEG的第一接触之间。 当组件被适当地布置并适当地加热时，第一接触件被烧结到第一导体层。